Samsung SCX-8030ND Series - ESD Precautions

1. Prec
a
1.3 ESD Precautions
Certain semiconductor devices can be easily damage
d
commonly called “Electrostatically Sensitive (ES) Dev
integrated circuits some field effect transistors and se
integrated
circuits
,
some
field
effect
transistors
,
and
se
The techniques outlined below should be followed to
h
caused by static electricity.
Caution >>Be sure no power is applied to the chassis
1. Immediately before handling a semiconductor com
p
off any electrostatic charge on your body by touchi
n
commercially available wrist strap device, which sh
o
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped wit
h
such as aluminum or copper foil, or conductive foa
m
vicinity of the assembly.
3. Use only a grounded tip soldering iron to solder or
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4 Use only an
“
anti
static
”
solder removal device Som
4
.
Use
only
an
anti
-
static
solder
removal
device
.
Som
static” can generate electrical charges sufficient to
5. Do not use Freon-propelled chemicals. When spra
y
damage ESDs.
6. Do not remove a replacement ESD from its protecti
v
Most replacement ESDs are packaged with all lead
s
or a comparable conductive material.
7. Immediately before removing the protective shortin
g
touch the protective material to the chassis or circui
8. Maintain continuous electrical contact between the
E
until completely plugged or soldered into the circuit.
9. Minimize bodily motions when handling unpackage
d
the brushing together of clothing fabric and lifting o
n
electricity sufficient to damage an ESD
electricity
sufficient
to
damage
an
ESD
.
Service Manual
SCX-8030/8040 series
1
-
a
utions
d
by static electricity. Such components are
ices” or ESDs. Examples of typical ESDs are:
emiconductor
“
chip
”
components
emiconductor
chip
components
.
h
elp reduce the incidence of component damage
or circuit, and observe all other safety precautions.
p
onent or semiconductor-equipped assembly, drain
n
g a known earth ground. Alternatively, employ a
ff
o
uld be removed
f
or your personal sa
f
ety reasons
h
ESDs, place the assembly on a conductive surface,
m
, to prevent electrostatic charge buildup in the
d
esolder ESDs.
me solder removal devices not classified as
“
anti
me
solder
removal
devices
not
classified
as
anti
-
damage ESDs.
y
ed, these can generate electrical charges sufficient to
v
e packaging until immediately before installing it.
s
shorted together by conductive foam, aluminum foil,
g
material from the leads of a replacement ESD,
t assembly into which the device will be installed.
E
SD and the assembly into which it will be installed,
d
replacement ESDs. Normal motions, such as
n
e’s foot from a carpeted floor, can generate static
SAMSUNG ELECTRONICS
Version 0.05
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