Samsung SL-C2670FW - Page 3

Contents
2.2.5.2.GUIOPEController......................................................................................2−27
2.2.5.3.FaxBoard....................................................................................................2−29
2.2.5.4.WirelessLANboard......................................................................................2−29
2.2.5.5.SMPSboard.................................................................................................2−31
2.2.5.6.HVPSboard.................................................................................................2−33
2.2.5.7.ITBEEPROMPBA.......................................................................................2−34
2.2.5.8.HUBPBA...................................................................................................2−34
2.2.5.9.SD-CARDPBA............................................................................................2−35
2.2.5.10.ElectricalPartsLocation.................................................................................2−36
2.2.6.EngineF/WControlAlgorithm......................................................................................2−40
2.2.6.1.Feeding.......................................................................................................2−40
2.2.6.2.Transfer.......................................................................................................2−40
2.2.6.3.Fusing.........................................................................................................2−41
2.2.6.4.LSU............................................................................................................2−41
2.2.7.SoftwareDescriptions..................................................................................................2−42
2.2.7.1.Softwaresystemoverview..............................................................................2−42
2.2.7.2.Architecture.................................................................................................2−42
2.2.7.3.DataandControlFlow...................................................................................2−43
3.DisassemblyandReassembly..............................................................................................................3−1
3.1.Precautionswhenreplacingparts................................................................................................3−1
3.1.1.Precautionswhenassemblinganddisassembling...............................................................3−1
3.1.2.PrecautionswhenhandlingPBA.....................................................................................3−1
3.1.3.ReleasingPlasticLatches..............................................................................................3−2
3.2.Screwsusedintheprinter..........................................................................................................3−3
3.3.Replacingthemaintenanceparts.................................................................................................3−5
3.3.1.TonerCartridge...........................................................................................................3−5
3.3.2.WasteTonerContainer.................................................................................................3−6
3.3.3.ITBUnit....................................................................................................................3−7
3.3.4.FuserUnit..................................................................................................................3−9
3.3.5.Pickup_Forward_Reverseroller.....................................................................................3−10
3.4.ReplacingthemainSVCparts....................................................................................................3−11
3.4.1.LeftandRightcover....................................................................................................3−11
3.4.2.HVPSboard...............................................................................................................3−12
3.4.3.OuterTemperatureSensor.............................................................................................3−12
3.4.4.MainBoard................................................................................................................3−13
3.4.5.SMPSFan..................................................................................................................3−13
3.4.6.SMPSboard...............................................................................................................3−14
3.4.7.RADFUnit................................................................................................................3−14
3.4.8.OPEUnit...................................................................................................................3−15
3.4.9.PlatenUnit.................................................................................................................3−16
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