3-9
3. Disassembly and Reassemble
NOTE
Notice for ASSY MISC P-CHASSIS TOP Assembly
Assembly process of mechanical tools (1)
1. To apply countermeasures against breaking defect
1-1. Causes
-During placement of a panel and MF guide, the panel is hung
due to embo interrruption, which provokes the panel to be
broken which T/C assembly.
1-2. Solutions
-To conduct 4 siodes touching inspection by operators.
-To quantify SOP because of operational defects between DS
photoelectricity progress.
Assembly process of mechanical tools (2)
2. To apply countermeasures against TAB IC dent defect
2-1. Causes
-A dent occurs due to T/C & S-IC interrruption which is caused
by T/C assembly on the opposite or the L/R of the S-PCB.
2-2. Solutions
-To x the top chassis by making it leant based on S-PCB.
-To quantify SOP because of operational defects between DS
photoelectricity progress.
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