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Plug in, warm up nozzle, place tip on solder, press button to absorb melted solder.
Lift handle to remove grip, then remove solder waste from cylinder.
Turn nozzle counter-clockwise with pliers to remove after cooling.
Keep away from children, unplug before cleaning, do not unscrew housing, ensure supervision for users.
Plug in, warm up nozzle, place tip on solder, press button to absorb melted solder.
Lift handle to remove grip, then remove solder waste from cylinder.
Turn nozzle counter-clockwise with pliers to remove after cooling.
Keep away from children, unplug before cleaning, do not unscrew housing, ensure supervision for users.
The Tenma Desoldering Iron, identified by part number 21-8240, is a specialized tool designed for the efficient removal of solder from electronic components and circuit boards. This device operates by heating solder to its melting point and then, through a vacuum mechanism, absorbing the molten solder, thereby allowing components to be safely detached or repositioned. Its design prioritizes ease of use and effective solder removal, making it a valuable tool for electronics enthusiasts, hobbyists, and professionals engaged in repair, rework, or prototyping tasks.
At its core, the desoldering iron integrates a heating element with a vacuum pump, creating a synergistic system for solder removal. The primary function involves applying the heated nozzle tip directly to the solder joint. As the solder melts, a button on the handle, when pressed, activates the internal vacuum pump. This pump generates suction, drawing the molten solder into a collection chamber within the device. This process effectively clears the solder joint, freeing the component lead or pad. The device is designed to reach an optimal operating temperature, typically requiring approximately 10 minutes to warm up, ensuring that solder melts quickly and thoroughly for efficient removal. The integrated vacuum mechanism is crucial for clean desoldering, preventing solder bridges and minimizing damage to surrounding components or the PCB itself. The precise application of heat and the controlled suction allow for delicate work, making it suitable for both through-hole and some surface-mount component desoldering, depending on the specific nozzle used and the user's skill. The continuous heating capability ensures that the tool remains at temperature throughout the desoldering process, facilitating multiple solder joint removals without significant delays.
The Tenma Desoldering Iron is engineered for straightforward operation, focusing on user convenience and effective solder removal. To begin, the device must be plugged into a power source. A crucial initial step is allowing the nozzle to warm up for approximately 10 minutes. This preheating period is essential to ensure the tip reaches the necessary temperature for efficient solder melting. Once adequately heated, the user presses a knob until it clicks, indicating the device is ready for use. The heated tip of the nozzle is then placed directly against the solder joint intended for removal. As the solder melts and becomes liquid, the user presses a button located on the handle. This action activates the internal vacuum pump, which swiftly absorbs the molten solder into the device's collection chamber. The design of the handle and the placement of the activation button are ergonomic, allowing for comfortable grip and easy one-handed operation during the desoldering process. This intuitive workflow minimizes the learning curve, enabling users to quickly become proficient in its operation. The controlled suction ensures that only the molten solder is removed, leaving the component and PCB intact. The device's robust construction is intended to withstand the rigors of regular use in various electronic repair and assembly environments.
Maintaining the Tenma Desoldering Iron is crucial for its longevity and consistent performance, with a focus on keeping the solder collection mechanism clear and the nozzle in optimal condition. Regular cleaning is a key aspect of maintenance. The device features a design that allows for easy access to the solder collection area. To clean, the user first lifts the handle slightly in the direction of the button, which allows it to be removed from the grip. This provides access to the cylinder where solder waste accumulates. It is important to remove any accumulated solder waste from around the cylinder to prevent blockages and ensure efficient suction during future operations. This simple cleaning procedure helps maintain the vacuum's effectiveness and prevents the buildup of debris that could impair performance.
Nozzle replacement is another important maintenance task. Over time, nozzles can wear out or become clogged, affecting heating efficiency and suction. To replace the nozzle, the user turns it counter-clockwise, typically with the aid of pliers or a similar tool, and then removes it from the handle. A new nozzle can then be installed by screwing it in clockwise. A critical safety precaution for both cleaning and nozzle replacement is to always turn off the power to the unit and allow it to cool down completely before attempting any maintenance. This prevents burns from the hot nozzle and ensures electrical safety. The design of the device facilitates these maintenance tasks, making them relatively straightforward for the user to perform, thereby extending the life of the tool and ensuring its continued reliability. The appliance is not a toy and should be kept out of children's hands. Furthermore, it is not intended for use by persons with reduced physical, sensory, or mental capabilities, or lack of experience and knowledge, unless supervised or instructed by a responsible person. Before cleaning or changing the filter, the power lead plug must always be removed from the socket, and unscrewing the housing is not permitted.
General| Line Regulation | ≤0.01% + 3mV |
|---|---|
| Ripple & Noise | ≤1mV RMS |
| Model | 21-8240 |
| Output Voltage | 0-30V DC |
| Output Current | 0-5A |
| Type | Linear |
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