NINA-W1 series - System Integration Manual
UBX-17005730 - R07 Handling and soldering Page 38 of 47
The reflow profile used is dependent on the thermal mass of the entire populated PCB, heat transfer
efficiency of the oven, and particular type of solder paste used. The optimal soldering profile used
has to be trimmed for each case depending on the specific process and PCB layout.
Process parameter Unit Value
Pre-heat Ramp up rate to T
SMIN
K/s 3
T
SMIN
°C 150
T
SMAX
°C 200
t
S
(from 25 °C) s 150
t
S
(Pre-heat) s 110
Peak T
L
°C 217
t
L
(time above T
L
) s 90
T
P
(absolute max) °C 245
t
P
(time above T
P
-5 °C) s 40
Cooling Ramp-down from T
L
K/s 4
General T
to peak
s 300
Allowed soldering cycles - 1
Table 6: Recommended reflow profile
Figure 26: Reflow profile
Lower value of T
P
and slower ramp down rate (2 – 3 °C/sec) is preferred.
After reflow soldering, optical inspection of the modules is recommended to verify proper alignment.
⚠ Target values in Table 6 should be taken as general guidelines for a Pb-free process. Refer to
JEDEC J-STD-020C standard for further information.
4.3.2 Cleaning
Cleaning the modules is not recommended. Residues underneath the modules cannot be easily
removed with a washing process.
• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pads. Water will also
damage the sticker and the ink-jet printed text.
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