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Wieland AGC Micro Plus - Page 52

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● The power levels were set too low.
The power levels are directly related to the
calculated gold electrolyte volume.
Make a note of the correct power level for each
part, in order to set them correctly before the
process commences. (see deposition data).
see Section 9.
● A power failure occurred during the electro-
forming process.
see Sections 2 and 3 (error codes)
● An excess of contact adhesive has formed an
insulating layer on the copper rod.
Use a scalpel to clean the copper rod all
the way to the plaster die before applying the
conductive silver varnish.
There are gaps in the surface of the crown coping.
● The surface to be electroformed was not
properly coated with conductive silver varnish
see Section 2.
● The part was in contact with the beaker.
Ensure that there is always an adequate
gap between the plaster die and the beaker.
The plaster dies have fallen off.
● Either too little or the wrong contact adhesive
was used, or the contact holes were too big.
Ensure that the plaster die is securely fixed
to the copper rod.
● The conductive silver varnish was not applied to
the section between the plaster die and the
copper rod, and the copper rod is corroded.
Ensure that approx. 1 cm of conductive
silver varnish is applied to the copper rod and
that the shrink-fit tubing is applied at a distance
of max. 1 mm from the plaster die.
If the faults cannot be rectified with the aid of these
instructions, please contact WIELAND EDELMETALLE or
your authorized dealer.
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