SERVICE MANUAL
HAMAMATSU, JAPAN
1.498K-0053 K Printed in Japan 2001.07
011580
SY
CONTENTS
SPECIFICATIONS .............................................................................. 3
CIRCUIT BOARD LAYOUT................................................................. 5
PANEL LAYOUT.................................................................................. 8
WIRING............................................................................................. 14
DISASSEMBLY PROCEDURE (MOTIF6, MOTIF7) ......................... 16
DISASSEMBLY PROCEDURE (MOTIF8) ........................................ 23
LSI PIN DESCRIPTION .................................................................... 37
IC BLOCK DIAGRAM........................................................................ 43
CIRCUIT BOARDS ........................................................................... 47
TEST PROGRAM ....................................................................... 60, 76
ERROR MESSAGES .................................................................. 73, 90
OS VERSION UPDATE .............................................................. 75, 92
MIDI IMPLEMENTATION CHART
PARTS LIST
BLOCK DIAGRAM
OVERALL CIRCUIT DIAGRAM
This document is printed on chlorine free (ECF) paper with soy ink.
MOTIF6
/
MOTIF7
/
MOTIF8
MUSIC PRODUCTION SYNTHESIZER
MOTIF6
MOTIF7
MOTIF8
MOTIF6 20010630-230000
MOTIF7 20010630-255000
MOTIF8 20010801-325000
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