Acer X1230S Series - Page 45

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(Fig. 6-1).
Fig. 6-1
7. Assembly OP ENG
7.1 Assemble “Baffle DMD” to “HSG DMD” (Fig.7-1).
7.2 Assemble Chip B/D Module to “HSG DMD” (Fig. 7-2).
Fig.7-1
Fig.7-2
7.3 Assemble Thermal Pad & Gasket Hest-sink then place contact DMD (Fig. 7-3).
(1) Pre-fastening Sequence: [ 1 ] - [ 2 ] - [ 3 ] - [ 4 ].
(2) Fastening Sequence: [ 4 ] - [ 3 ] - [ 2 ] - [ 1 ].
(3) Screw Torque must be confirmed to be 6 kg-cm.
Screw
Shield CW
BKT Link Lamp
Fixed shafts of
DMD HSG
Fixed holes of
ILL SUB HSG
Fixed holes of DMD Fixed shafts of
DMD HSG