The NodeMCU-BU01 is a development board for the BU01 module, equipped with an STM32F103C8T6MCU. It is designed to add temperature and humidity sensors and a three-dimensional acceleration sensor, catering to developers engaged in debugging and convenience. The BU01 is an ultra-wideband (UWB) transceiver module based on the Decawave DW1000 design. It integrates an antenna, RF circuit, power management, and clock circuits. The BU01 can be used in bidirectional ranging and TDOA positioning systems, offering positioning accuracy up to 10cm and supporting data rates up to 6.8Mbps.
Key Features:
- Easy integration: Seamless integration without complex RF design.
- Extended communications: Utilizes RTLS infrastructure for enhanced communication capabilities.
- High label density support: Capable of handling a large number of devices in a given area.
- Compliance: Adheres to IEEE 802.15.4-2011UWB standards.
- Channel support: Supports 4 channels across 3.5GHz to 6.5GHz.
- Programmable transmit power: Allows for flexible power configuration.
- Power supply: Operates on a 3.3V / 5V power supply.
- Low power consumption: Consumes less than 1mA in sleep mode.
- Bidirectional ranging and TDOA support: Facilitates precise positioning applications.
- SPI interface support: Provides a standard Serial Peripheral Interface.
- High data rate: Supports data rates of 100kbps, 850kbps, and 6.8Mbps.
Technical Specifications:
- Model Name: NodeMCU-BU01
- Dimensions: 35 × 55.5 (±0.2) mm (W×H)
- Package: DIP-40
- Antenna: PCB antenna
- Frequency Range: 3.5GHz to 6.5GHz
- Interface: All IO of PWM/I2C/GPIO, MCU
- Operating Temperature: -40 ℃ to 85 ℃
- Storage Environment: -40 ℃ to 125 ℃, < 90%RH
- Power Supply: 5V or 3.3V
- Power Consumption: Development board: 160 mA (with MCU, sensors)
Absolute Maximum Ratings:
- Micro USB supply voltage: 5V
- Pin header 3.3V supply voltage: 3.3V
- Operating temperature: -40 ℃ to +85 ℃
- Storage temperature: -40 ℃ to +125 ℃
Pin Definition and Functionality:
The NodeMCU-BU01 module has a total of 50 interfaces. The pin function definition table outlines the interface definitions:
- Pin 1 (107): Default value is used as SYNC input. This pin can be reconfigured as a universal I/O pin GPI07 under software control.
- Pin 2 (106): Universal I/O pin. When powered on, it is used as the SPIPHA (SPI phase selection) pin for configuring the SPI mode of operation. After power on, this pin will default to universal I/O pin.
- Pin 3 (105): Universal I/O pin. When powered on, it is used as a SPIPOL (SPI polarity selection) pin for configuring SPI working mode. After power on, this pin will default to universal I/O pin.
- Pin 4 (104): Universal I/O pin.
- Pin 5 (IRQ): The interrupt request output from the DW1000 to the host processor and is connected to the MCU PB0. By default, the IRQ is a high-level efficient output, but can be configured as low-level valid if required. To run correctly in SLEEP and DEEPSLEEP mode, it should be configured to run efficiently at high levels. This pin will float in hibernation and DEEPSLEEP states and may cause a pseudo interrupt unless it is pulled low. This pin can be reconfigured as a generic I/O line GPI08, when no IRQ function is used.
- Pin 6 (CLK): SPI clock and connected to MCU PA5.
- Pin 7 (MISO): SPI data output and connected to MCU PA6.
- Pin 8 (MOSI): SPI data input and connected to MCU PA7.
- Pin 9 (CSN): SPI chip select and connect with MCU PA4. This is a low level effective enable input. SPICSn jumps from high to low indicate the beginning of a new SPI transaction. SPICSn can also be used as a wake-up signal to get DW1000 out of sleep or sleep state.
- Pin 10 (PA3): PA3 on the MCU.
- Pin 11 (PB1): PB1 on the MCU.
- Pin 12 (PB10): PB10 on the MCU.
- Pin 13 (PB11): PB11 on the MCU.
- Pin 14 (LED1): PA2, connection LED1 on the MCU.
- Pin 15 (LED2): PA1, connection LED2 on the MCU.
- Pin 16 (BTN): PA0, connection BTN keys on the MCU.
- Pin 17 (RESET): Reset pin on MCU, connect reset button.
- Pin 18 (GND): Ground.
- Pin 19 (GND): Ground.
- Pin 20 (V3.3): 3.3 V Power supply.
- Pin 21 (V5): 5V power supply.
- Pin 22 (V3.3): 3.3 V Power supply.
- Pin 23 (GND): Ground grounding.
- Pin 24 (VBAT): Vbat MCU battery power.
- Pin 25 (SCL): SCL pin on MCU, default pull up 3.3 V, internal connect sensor SCL pin.
- Pin 26 (SDA): SDA pin on MCU, default pull up 3.3 V, internal connect sensor SDA pin.
- Pin 27 (PB8): PB8 on the MCU.
- Pin 28 (PB9): PB9 on the MCU.
- Pin 29 (PB5): PB5 on the MCU.
- Pin 30 (PB4): PB4 on the MCU.
- Pin 31 (PB3): PB3 on the MCU.
- Pin 32 (PA15): PA15 on the MCU.
- Pin 33 (V3.3): 3.3 V Power supply.
- Pin 34 (RST): Reset pin on BU01 and connected to MCU PB12.
- Pin 35 (WAKEUP): The wake-up pin on the BU01 and is connected to the PB13 of the MCU. When set to a valid high level state, the WAKEUP pin brings the DW1000 into working mode from a dormant or DEEPSLEEP state. If not used, the pin can be grounded.
- Pin 36 (EXTON): The EXTON pin on the BU01 is connected to the MCU PB14 and the external device is enabled. Position and remain active during wake-up until the device enters sleep mode. Can be used to control external DC-DC converters or other circuits not required when the device is in sleep mode to minimize power consumption.
- Pin 37 (U1RX): UART1-RX on the MCU.
- Pin 38 (U1TX): UART1-TX on the MCU.
- Pin 39 (PA8): PA8 on the MCU.
- Pin 40 (PB15): PB15 on the MCU.
- D10 (Swdio): SWDIO feet on MCU, default flash pin.
- CLK (Swclk): SWDIO feet on MCU, default flash pin.
BOOT Pin Controls Start-up Mode:
The BOOT pins (BOOT0 and BOOT1) control the start-up mode of the device:
| BOOT0 |
BOOT1 |
MODE |
| 0 |
x |
FLASH |
| 1 |
1 |
SRAM |
| 1 |
0 |
ISP |
Design Guidance:
- Antenna Layout Requirements: It is forbidden to place metal parts around the antenna, and to put away from high frequency devices.
- Power Supply:
- Programme I: Standard Micro USB interface power supply.
- Programme II: Pin 3.3 V Power supply.
- (1) Recommend 3.3 V voltage, peak over 500mA current.
- (2) Recommend the use of LDO power supply; if used DC-DC the recommended ripple is controlled within 50mV.
- (3) DC-DC power supply circuit is suggested to reserve the position of dynamic response capacitance, which can optimize the output ripple when the load changes greatly.
- (4) 3.3 V The proposed addition of ESD devices.
Reflow Soldering Profile:
The recommended reflow soldering profile for the NodeMCU-BU01 is as follows:
- Preheating Zone:
- Temperature: 25 ℃ to 150 ℃
- Time: 60 - 90s
- Ramp-up rate: 1 - 3 ℃/s
- Soak Zone:
- Temperature: 150 ℃ to 200 ℃
- Time: 60 - 120s
- Ramp-up rate: 0.3 - 0.7 ℃/s
- Reflow Zone:
- Peak temperature: 235 ℃ to 250 ℃
- Time above 217 ℃: 60 - 90s
- Time above 235 ℃: 30 - 70s
- Cooling Zone:
- Temperature: >180 ℃
- Cooling rate: -1 to -5 ℃/s
- Solder: Lead-free solder (SAC305)
The NodeMCU-BU01 module is packaged in an electrostatic bag.
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