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Socket | Socket 754, Socket S1 |
---|---|
Number of Cores | 1 |
Thermal Design Power (TDP) | 25W - 35W |
Microarchitecture | K8 |
Clock Speed | 1.6 GHz - 2.4 GHz |
Manufacturing Process | 90 nm |
L1 Cache | 128 KB |
Virtualization Technology | AMD-V (some models) |
Core Name | Lancaster, Richmond |
HyperTransport | 800 MHz |
Supports 32-bit code, SSE/SSE2/SSE3, MMX, 3DNow!, AMD64 extensions, and Enhanced Virus Protection.
Details on 64-Kbyte L1 data/instruction caches and 16-way associative L2 cache with ECC.
Features HyperTransport to I/O devices and Machine Check Architecture for hardware scrubbing.
Information on the 754-pin lidless micro PGA package, pin pitch, and substrate.
Features a low-latency, high-bandwidth 72-bit DDR SDRAM controller up to 200 MHz.
Specifies HyperTransport and DDR SDRAM electrical interface characteristics.
Covers low-power states, SMM, ACPI compliance, and AMD PowerNow! technology.
Details the 638-pin lidless micro PGA package, pin pitch, and RoHS compliance.
Features a 128-bit DDR2 SDRAM controller up to 333 MHz with support for SO-DIMMs.
Describes HyperTransport and DDR2 SDRAM electrical interface specifications.
Includes low-power states, SMM, ACPI compliance, and AMD PowerNow! technology.