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Overview of the module's technical specifications and capabilities.
Visual representation of the module's architecture and component connections.
Details on voltage inputs, rails, and supply characteristics.
Analysis of power usage under different operating scenarios.
Physical size, mounting hole placement, and overall form factor.
Information on PCB bending limits for heat sink mounting.
Defines PCB temperature measurement points and limits.
Details on I2S links for audio codec connection and features.
Description of the 10/100/1000 Mbps Ethernet controller and pins.
Specifications for PCIe x1 Gen2 lanes and related signals.
Details on USB 3.0 and USB 2.0 support and available lanes.
Information on MIPI CSI-2 interface support for cameras.
LVDS channel availability and features for display output.
Specifications for HDMI 2.0a and DisplayPort 1.3 signal support.
Description of Enhanced Configurable SPI (ECSPI) buses and signals.
Details on CAN 2.0B interfaces and MCP2515 controller.
General Purpose Input/Output pin usage and configuration.
Description of SDIO interface capabilities and modes.
Details on UART interfaces, modes, and flow control.
Information on I2C bus standards and device connections.
Functionality of the module's watchdog timer output.
Signals related to power management and system control.
Pins and settings that determine the module's boot device.
Overview of available i.MX8M CPU types and features.
Module behavior during power transitions and button presses.
Details on SDRAM and eMMC memory options and capacities.
Optional TPM integration for enhanced security.
Details on the on-board WiFi and Bluetooth module.
Description of module status LEDs (Software, Power, Reset).
Details on the 8-pin FFC connector for accessing the Debug UART port.
Information on the 10-pin FFC connector for JTAG access to the CPU.
Table listing I2C interfaces, devices, and addresses.
Table detailing SPI interfaces, chip selects, and devices.
Introduction to the Yocto build system and MSC-LDK.
Details on the specific MSC-LDK and NXP release used.
Definitions of Yocto terms like target, image, package, recipe, layer, BSP.
System requirements and initial setup steps for MSC-LDK.
Instructions for cloning, creating build directories, and using Docker.
Information on available images and the build process.
Procedures for flashing images to SD cards.
Steps for booting the module via SPL, OS from various media, and network.
Instructions for logging into the file system via serial console or telnet.
Mapping of SMARC GPIOs to IMX GPIOs and comments.
Process for generating and submitting bug reports using msc_bug_report.sh.
Methods for updating the MSC-LDK and applying hotfixes.
List of identified issues and workarounds for hardware and software.
Contact details for technical support.
General| Processor | NXP i.MX 8M Quad |
|---|---|
| Clock Speed | Up to 1.5 GHz |
| Architecture | ARM Cortex-A53 |
| RAM | Up to 4GB LPDDR4 |
| Storage | eMMC, SD card |
| Ethernet | Gigabit Ethernet |
| Connectivity | Wi-Fi, Bluetooth |
| Operating System | Linux, Android |
| Operating Temperature | -40°C to +85°C |
| Power Supply | 5V DC |
| Dimensions | 82mm x 50mm |
| Display | MIPI DSI |
| Audio | I2S |
| Expansion | SMARC 2.0 |
| Form Factor | SMARC |
| GPU | Vivante GC7000UL |
| USB Ports | 2x USB 3.0 Host, 1x USB 2.0 OTG |
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