Broadcom BCM2046 - Introduction; Hardware Architecture; Main Chipset Information; Circuit Block Diagram

Bluetooth Module for 3D TV
Version 1.0 Samsung Electronics page 2 of 6
1. Introduction
This module is USB I/F connector embedded module compliant with Bluetooth 2.1 , MAC/baseband/radio
optimized for low-power applications. The core chipset is from Brodcom, part number BCM2046B1.
This application is designed for 3D TV and wireless communication with 3D-Glasses.
2. Hardware Architecture:
2.1 Main Chipset Information
Item Vendor Part Number
Bluetooth 2.1
mac/baseband/radio
Brodcom BCM2046
2.2 Circuit Block Diagram
The major internal and external block diagram of Samsung remo-con module is illustrated in Figure 1-1.
Figure 1-1 Samsung BT module block diagram and System Interface
2.3 Module output power information
- Module output power within filter
Class type TX power(typ.) Data rate
Cass2 0dBm 1Mbps