9 PowerEdge R520 Technical Guide
PowerEdge R520 technical specification
High-efficiency, hot-plug redundant power supplies; DC power supply, hot-plug hard
drives; TPM; dual internal SD support; fan fault tolerance; optional bezel; information
tag; ECC memory; interactive LCD screen; extended power range; ENERGY STAR
®
compliant; switch independent partitioning
Dell OpenManage
Systems Management
(Agent-free or with
OpenManage Server
Administrator [OMSA]
Agent)
OpenManage Essentials
OMSA Agent
OpenManage Power Center (requires iDRAC7 Enterprise with Lifecycle
Controller)
OpenManage Integrations and Connections:
— OpenManage Integration Suite for Microsoft
®
System Center
— OpenManage Integration for VMware vCenter
— Connections for HP
®
Operations Manager, IBM
®
Tivoli
®
Netcool
®
and
CA Network and Systems Management
Basic management (standard option)
— Upgrade to iDRAC7 (Express or Enterprise) with Lifecycle Controller
— Upgrade to 8GB vFlash media or 16GB vFlash media for iDRAC7 Enterprise
with Lifecycle Controller
— Trial evaluations available for IDRAC7 (Express and Enterprise) with Lifecycle
Controller
ReadyRails™ II sliding rails for tool-less mounting in 4-post racks with square or
unthreaded round holes or tooled mounting in 4-post threaded hole racks, with
support for optional tool-less cable management arm
ReadyRails static rails for tool-less mounting in 4-post racks with square or
unthreaded round holes or tooled mounting in 4-post threaded and 2-post
(Telco) racks
Microsoft Windows Server
®
2012 R2 (includes Hyper-V
®
)
Microsoft Windows Server 2012
Microsoft Windows Server 2008 R2 SP1, x64 (includes Hyper-V)
Microsoft Windows
®
Small Business Server 2011
Novell
®
SUSE
®
Linux Enterprise Server
Red Hat
®
Enterprise Linux
®
Virtualization options:
Citrix
®
XenServer
®
VMware vSphere ESXi
Red Hat Enterprise Virtualization
®
For more information on the specific versions and additions, visit
Dell.com/OSsupport.
1
GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating environment and will
be less.