ESP8266EX also integrates an enhanced version of Tensilica’s L106 Diamond series 32-bit processor,
with on-chip SRAM, besides the Wi-Fi functionalities. ESP8266EX is often integrated with external
sensors and other application specific devices through its GPIOs; sample codes for such applications
are provided in the software development kit (SDK).
Espressif Systems’ Smart Connectivity Platform (ESCP) demonstrates sophisticated system-level
features include fast switching between sleep and wake-up mode for energy-efficiency purpose,
adaptive radio biasing for low-power operation, advance signal processing, and spur cancellation
and radio co-existence features for common cellular, Bluetooth, DDR, LVDS, LCD interference
mitigation.
1.2. Features
• 802.11 b/g/n
• Integrated low power 32-bit MCU
• Integrated 10-bit ADC
• Integrated TCP/IP protocol stack
• Integrated TR switch, balun, LNA, power amplifier and matching network
• Integrated PLL, regulators, and power management units
• Supports antenna diversity
• Wi-Fi 2.4 GHz, support WPA/WPA2
• Support STA/AP/STA+AP operation modes
• Support Smart Link Function for both Android and iOS devices
• SDIO 2.0, (H) SPI, UART, I2C, I2S, IR Remote Control, PWM, GPIO
• A-MPDU & A-MSDU aggregation & 0.4s guard interval
• Deep sleep power <10uA, Power down leakage current < 5uA
• Wake up and transmit packets in < 2ms
• Standby power consumption of < 1.0mW (DTIM3)
• +20 dBm output power in 802.11b mode
• Operating temperature range -40C ~ 125C
• FCC, CE, TELEC, Wi-Fi Alliance, and SRRC certified
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