F&S Bondtec 56 i Series User Manual

Name: F&S Bondtec 56 i Series
Brand: F&S Bondtec
Rating: 4 (1 reviews)

57 pages

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Series 56XXi

F&S BONDTEC Semiconductor GmbH

User manual BONDSTAR 2.0

Table of Contents3
General Information5
Applicability of this User Guide5
Scope of Documentation7
For Your Safety8
User Manual8
General Instructions for Safe Operation9
CE Declaration of Conformity9
Intended Use9
Obvious Misuse10
Residual Hazards10
Protective Equipment / Personal Protective Equipment10
Parent Safety Instructions11
Technical Specifications12
Dimension and Weight12
Workspace12
Environmental Conditions and Connections13
Bondhead13
Spezification14
Model 56Xxi15
Overview of the Multifunction Device16
Control Elements16
The Axes of the Motion System17
Bond Heads18
Transport and Installation21
Transport / Packaging21
Storage21
Suitable Operating Location21
Preparatory Work for Commissioning21
Electrical Connection22
Vacuum Connection23
Connection of the Ultrasonic Generator23
Basic Functions24
The most Important Functions25
Simple Actions26
Frequently Returning Operation27
Create a Bond Program28
Further Process Parameters28
The Single Wire Mode29
Bonding in Single Wire Mode30
Working in Single Step Mode (Step Mode)31
Process Optimization32
Bond Parameters32
Loop34
Multiwire Program38
Creating Chips with "Learn Chip38
Creating Wires with Learn Wire39
Duplicating Modules39
Normalize Program40
Measure Chipheights40
Move the Bond Program40
Change Bondprogram with Plot Program (Show Program)41
Production Operation44
Quality Control45
Pattern Recognition45
Calibrations47
Camera Convex Compensation47
Head Calibration47
Camera Offset48
Axis Calibration48
Adjustment Work on the Bondhead49
Bonding Wire49
Bond Tool51
Mechanical Settings52
Cleaning of the Components56

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F&S Bondtec 56 i Series Specifications

General

Brand	F&S Bondtec
Model	56 i Series
Category	Test Equipment
Language	English

F&S Bondtec 56 i Series User Manual

Table of Contents

Questions and Answers:

F&S Bondtec 56 i Series Specifications