OPERATION
QFP Soldering
1. Apply the solder paste.
Apply the proper quality of solder paste
and install the SMD on the PWB.
2. Preheat the SMD.
Refer to the photo to preheat SMD.
3. Soldering
Heat the lead frame evenly.
4. Cleaning
When soldering is completed, clean the
residual flux from the board with an
appropriate cleaner.
NOTE:
Soldering with hot air has many advantages,
such as the inherent ability to pre-heat the
component being replaced. As with any
soldering process, however, there is always the
possibility of forming solder balls, bridges
between leads, and inadequate solder joints.
Always inspect the finished solder joints for
structural and electrical integrity.
Turn the power switch off.
After the power switch is turned off, an
automatic blowing function begins sending
cool air through the pipe in order to cool the
handpiece. Do not disconnect the plug
during this cooling process.
CAUTION
During the cooling process, the amount of air is
controlled by the setting of the air flow adjustment
knob . Hakko recommends setting the knob at 8
when cooling for greatest efficiency.
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