INTRODUCTION
OF
PACKAGES
Hitachi microcomputer devices are offered
in
a variety of
packages, to meet various user requirements.
1.
Package
Classification
When selecting suitable packaging, please refer
to
the
Package Classifications given in Fig. I for pin insertion, surface
mount,
and
multi-function types, in plastic and ceramic.
Package Classification
Pin
Insertion
Type
Surface
Mounting
Type
Multi·function
Type
DIP;
DUAL
IN
LINE
PACKAGE
S·DIP;
SHRINK
DUAL
IN
LINE
PACKAGE
PGA:
PIN
GRID
ARRAY
FLAT·DIP;
FLAT
DUAL
IN
LINE
PACKAGE
FLAT·QUIP;
FLAT
QUAD
IN
LINE
PACKAGE
CC: CHIP
CARRIER
SOP;SMALL
OUTLINE
PACKAGE
FPP;
FLAT
PLASTIC
PACKA.GE
PLCC;PLASTIC
LEADED
CH1P
CARRIER
LCC ;
LEADLESS
CHIP CARRI·ER
Plastic
DIP
Ceramic DIP
Shrink
Type
Plastic
DIP
Shrink
Type
Ceramic DIP
SOP
(Plastic)
FPP
(Plastic)
PLCC (Plastic)
LCC
(Glass Sealed
Ceramic)
Fig. 1 Package Classification according to Material and Printed Circuit Board
Mounting
Type
11
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