Hitachi AP1 - Page 31

------------------RELIABILITY TEST DATA OF MICROCOMPUTER
Table 7 Mechanical and Environmental Test
Test
Item Condition
Plastic DIP Flat Plastic Package
Sample Size Failure
Sample Size Failure
Thermal
Shock
OOC -100°C
150
0
100
0
10 cycles
Soldering
Heat 260°C, 10 sec.
140
0
160
0
Salt
Water Spray
35°C, NaCI 5%
40
0 40
0
24 hrs
Solderability
230°C, 5 sec.
34
0 34
0
Rosin flux
Drop Test
75cm, maple board
38
0
38
0
3 times
Mechanical Shock
1500G,0.5ms
45
0 45 0
3 times/X, Y, Z
Vibration Fatigue
60 Hz, 20G
120
0
45
0
32hrs/X, Y, Z
Vibration Variable Freq.
100-2oooHz
45
0 45 0
20G,
4 times/X, Y, Z
225g, 90°
45 0
-
-
Lead Integrity
Bonding 3 times
225g, 90°
-
-
45
0
Bonding 1 time
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