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HP 2510p - Intel PRO;Wireless 3945 BG Specifications

HP 2510p
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Weight
0.35 oz (10 g)
Dimensions
(Length x
Width x Thickness)
2.01 x 1.18 x 0.18 in (51 x 30 x 4.5 mm)
Voltage, Operating
3.3v +/- 10%
Temperature, Operating
–22° to 140° F (–30° to 60° C) (full RF performance)
–22° to 167° F (–30° to 75° C) (reduced RF performance)
Temperature, Non-
operating, 96 hours
(from
MIL-STD 202 Method 108)
–40° to 185° F (–40° to 85° C)
Humidity, Non-operating
85% relative humidity for 48 hours @ 185° F (85° C) (non-condensing)
LED Activity
LED Off – Radio Off;
Solid LED On – Radio On
Configuration Utilities
Varies per country and mobile network operator
Intel PRO/Wireless
3945BG Network
Connection
Wireless LAN Standards
IEEE 802.11b
IEEE 802.11g
Interoperability
Wi-Fi certified
Cisco Compatible Extensions Program compliant with Microsoft Windows
2000 and XP (details at
http://www.hp.com/go/notebooks/WLAN
)
Frequency Band
2.4 GHz
Data Rates
802.11b: 1, 2, 5.5, 11 Mbps
802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps
Modulation
Direct Sequence Spread Spectrum
DBPSK, DQPSK, CCK, OFDM
Security
1
Supports 64- and 128-bit WEP, WPA, WPA2, hardware-accelerated AES,
802.1x authentication types EAP-TLS, EAP-TTLS, PEAP-GTC, PEAP-MSCHAPv2,
LEAP, EAP-FAST, EAP-SIM.
Support for Cisco Security Features (proven compatibility with Cisco Aironet
infrastructure products through the Cisco Compatible Extensions Program
Version 4).
Sub-channels
Multinational support with frequency bands and channels compliant to local
regulations.
Media Access Protocol
CSMA/CA (Collision Avoidance) with ACK
Network Architecture
Models
Ad-hoc (Peer to Peer)
Infrastructure (Access Point Required)
Roaming
IEEE 802.11 compliant roaming between access points
Output Power
(for CKK)
2
15 dBm
Output Power
(for OFDM;
power varies by data rate)
2
15 dBm
Power Consumption
Transmit: 1.8 Watts (max)
Receive: 1.4 Watts (max)
Idle mode
3
: 150 mW (nominal)
Sleep mode: 30 mW (max)
QuickSpecs
HP Compaq 2510p Notebook PC
Technical Specifications
DA - 12717 Worldwide — Version 22 — August 25, 2008
Page 28

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