HP 260 G3 Desktop Mini Business - Page 2

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdiver
TORX T8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Removed TOP Casel
2. Removed HDD, HDD Braket,
3. Removed Main Fan
4. Removed Heat shrink
5. Removed Button Case
6. Removed RAM and Wireless card
7. Removed MotherBoard
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Removed TOP Case