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HP 350 G1 Quickspecs

HP 350 G1
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SYSTEM UNIT
Stand-Alone Power
Requirements
(AC Power)
Nominal Operating
Voltage
18.5/19.5V
Average Operating Power
Integrated graphics: TBD W
Max Operating Power
< 65 W
Temperature
Operating
32° to 95° F (0° to 35° C) (not writing optical)
41° to 95° F (5° to 35° C) (writing optical)
Non-operating
-4° to 140° F (-20° to 60° C)
Relative Humidity
Operating
10% to 90%, non-condensing
Non-operating
5% to 95%, 101.6° F (38.7° C) maximum wet bulb temperature
Shock
Operating
40 G, 2 ms, half-sine
Non-operating
200 G, 2 ms, half-sine
Random Vibration
Operating
0.75 grms
Non-operating
1.50 grms
Altitude
(unpressurized)
Operating
-50 to 10,000 ft (-15.24 to 3,048 m)
Non-operating
-50 to 40,000 ft (-15.24 to 12,192 m)
Planned Industry
Standard
Certifications
UL
Yes
CSA
Yes
FCC Compliance
Yes
ENERGY STAR®
Select models
*
EPEAT
Registered Silver in United States
**
ICES
Yes
Australia /
NZ A-Tick Compliance
Yes
CCC
Yes
Japan VCCI Compliance
Yes
KC
Yes
BSMI
Yes
CE Marking Compliance
Yes
BNCI or BELUS
Yes
CIT
Yes
GOST
Yes
Saudi Arabian Compliance
(ICCP)
Yes
SABS
Yes
UKRSERTCOMPUTER
Yes
QuickSpecs
HP 350 G1 Notebook PC
Technical Specifications
DA - 14878 Worldwide — Version 5 — March 17, 2014
Page 11

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HP 350 G1 Specifications

General IconGeneral
Form factorClamshell
Product typeLaptop
Product colorBlack, Silver
Country of originChina
Bus typeDMI
Tjunction100 °C
Processor cache3 MB
Processor cores2
System bus rate5 GT/s
Processor familyIntel® Core™ i3
Processor seriesIntel® Core™ i3-4000 Mobile Series
Processor socketBGA 1168
Processor threads4
Processor codenameHaswell
Processor frequency1.7 GHz
Processor cache typeSmart Cache
Processor lithography22 nm
Processor manufacturerIntel
Processor front side bus- MHz
PCI Express slots version2.0
Processor operating modes64-bit
ECC supported by processorNo
PCI Express configurations4x1, 1x4
Thermal Design Power (TDP)15 W
Maximum number of PCI Express lanes10
Motherboard chipset-
Memory slots2x SO-DIMM
Internal memory4 GB
Memory clock speed1600 MHz
Internal memory typeDDR3L-SDRAM
Maximum internal memory- GB
Memory layout (slots x size)1 x 4 GB
HDD speed5400 RPM
HDD interfaceSATA
Storage mediaHDD
Optical drive typeDVD Super Multi DL
Card reader integratedYes
Total storage capacity500 GB
Number of HDDs installed1
Display surfaceMatt
Display diagonal15.6 \
Display resolution1366 x 768 pixels
Native aspect ratio16:9
On-board graphics card ID0xA16
Discrete graphics card modelNot available
On-board graphics card modelIntel® HD Graphics 4400
On-board graphics card familyIntel® HD Graphics
Maximum on-board graphics card memory2 GB
On-board graphics card base frequency200 MHz
On-board graphics card DirectX version12
On-board graphics card dynamic frequency (max)950 MHz
Audio systemDTS Sound
Wi-Fi standards802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version4.0
Top Wi-Fi standardWi-Fi 4 (802.11n)
Ethernet LAN data rates10, 100, 1000 Mbit/s
Charging port typeDC-in jack
DisplayPorts quantity0
USB 2.0 ports quantityUSB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
Pointing deviceTouchpad
Operating system installedWindows 8.1
Processor ARK ID75105
Processor package size40 x 24 x 1.5 mm
Intel ME Firmware Version9.5
Supported instruction setsAVX 2.0, SSE4.1, SSE4.2
Intel Smart Connect Technology version1.00
Intel Smart Response Technology version0.00
Battery capacity41 Wh
Battery life (max)- h
AC adapter power65 W
Sustainability certificatesENERGY STAR
Weight and Dimensions IconWeight and Dimensions
Depth384 mm
Width261 mm
Height23.1 mm
Weight2300 g

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