HP 6259B User Manual

SECTION VII
CIRCUIT DIAGRAM AND COMPONENT LOCATION DIAGRAMS
This section contains the schematic diagram and component
location diagrams necessary for maintaining this power sup¬
ply. Differences among the five power supply models
covered by this manual are indicated where they exist. The
test points indicated by circled numbers on the circuit
schematic of Figure 7-8 correspond to those on the com
ponent location diagrams and in the troubleshooting
procedures in Section V.
THIS PAD CONNECTS
AC LINE POTENTIAL
TO THE A2 ASS'Y
HEATSINK ANO CASE
[warning]
THE CASE, HEATSINK,
AND CIRCUITRY OF THE
A2 RFI ASSEMBLY ARE
AT AC UNE POTENTIAL,
EXERCISE EXTREME
CAUTION DURING
SERVICING.
NOTES
I. JUMPERS SHOWN
CONNECTED FOR
230VAC INPUT SEE
SECTION H FOR
VOLTAGE CONVERSION
INSTRUCTIONS.
2. TRIAC A2CRI IS
MOUNTED ON A2
HEATSINK.
3. A2R3 IS NOT USED
IN INSTRUMENTS
EQUIPPED FOR 208
OR 230VAC INPUT.
Figure 7-1. A2 RFI Assembly Component Locations
Figure 7-2. A3 Interconnection Board Component Locations
7-1

HP 6259B Specifications

General

Brand	HP
Model	6259B
Category	Power Supply
Language	English