Technical Reference Guide www.hp.com 3-3
Processor/Memory Subsystem
3.2.2 Processor Changing/Upgrading
These systems use the LGA1155 ZIF (H2) mounting socket and require that the processor use an
integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan
assembly as the original to ensure proper cooling. The heatsink and attachment mechanism are
designed to provide maximum heat transfer from the processor component.
CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper
attachment of the heatsink will likely result in a thermal condition. Although the system is designed to
detect thermal conditions and automatically shut down, such a condition could still result in damage to
the processor component. Refer to the applicable Maintenance and Service Guide for processor
installation instructions.
CAUTION: The CMT, MT, and SFF form factors can support a processor with a thermal design point
(TDP) of up to 95 watts. The USDT form factor can support a processor with a TDP of up to 65 watts.
Exceeding these limits can result in system damage and lost data.
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