HP Compaq dx2300 User Manual

The EPE foam packaging material is made from 30–60% recycled content.
The corrugated paper packaging materials contains at least 80% recycled content.
RoHS Compliance Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations,
including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed
compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis. By July 1,
2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for all HP
electronic products subject to the RoHS Directive, except where it is widely recognized that there is no
technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).
Material Usage This product does not contain any of the following substances in excess of regulatory limits (refer to the
HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html ):
Asbestos
Certain Azo Colorants
Certain Brominated Flame Retardants – may not be used as flame retardants in plastics
Cadmium
Chlorinated Hydrocarbons
Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel – finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Biphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC) – except for wires and cables, and certain retail packaging has been
voluntarily removed from most applications.
Radioactive Substances
Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)
Packaging HP follows these guidelines to decrease the environmental impact of product packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging
materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in packaging materials.
Use readily recyclable packaging materials such as paper and corrugated materials.
Reduce size and weight of packages to improve transportation fuel efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
End-of-life Management
and Recycling
Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas.
To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office.
Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
QuickSpecs
HP Compaq dx2300 Microtower Business PC
Technical Specifications - Environmental Data
DA - 12668 North America — Version 17 — May 21, 2008 Page 35

HP Compaq dx2300 Specifications

General

Processor cache	1 MB
Processor cores	2
Processor family	Intel® Pentium® D
Processor frequency	1.6 GHz
Processor cache type	L2
Processor manufacturer	Intel
Processor front side bus	800 MHz
Internal memory	0.5 GB
Internal memory type	DDR2-SDRAM
Maximum internal memory	4 GB
Memory layout (slots x size)	1 x 0.5 GB
HDD speed	7200 RPM
HDD interface	SATA
Optical drive type	DVD-RW
Card reader integrated	Yes
Total storage capacity	160 GB
Platform	PC
Audio input	1
CD read speed	16 x
Mac compatibility	No
External drive bays	2x 5.25\
Networking features	Gigabit Ethernet
Graphics card RAMDAC	400 MHz
Diskette drive memory	1.44 MB
USB 1.1 ports quantity	0
Audio formats supported	AAC, MP3, WAV, WMA
Compliance industry standards	IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Non-operating relative humidity (non-condensing)	5 - 95 %
Discrete graphics card model	-
Maximum graphics card memory	0.256 GB
Operating system installed	Windows XP Professional
USB 2.0 ports quantity	8
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Chassis type	Micro Tower
Product color	Black
Country of origin	China
Cable lock slot type	Kensington
Power supply	250 W
Operating temperature (T-T)	10 - 35 °C
Operating relative humidity (H-H)	10 - 90 %
Certification	FCC, CE, VCCI

Weight and Dimensions

Depth	416 mm
Width	175 mm
Height	353 mm
Weight	9600 g
Package weight	14000 g