EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
items
included in
greater than 2.5 cm in diameter or height
External electrical cables and cords
DC Cable for External Power Supply(Power
cords,Adapter)
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Remove log low assy
2. Remove battery pack
3. Remove HDD assy
4. Remove NGFF
5. Remove Thermal module
6. Remove MB and SD board/PCB
7. Remove LCD assy
8. Remove Speakers& DC IN cable
9. Remove Power Board and Thermal Sensor Board
10. Remove bezel & hinge cap assy
11. Remove LCD panel
12. Remove hinge r & hinge l assy
13. Remove LCD support bracket
14. Remove EDP cable & antenna cable
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