8. Remove the fan/heat sink assembly (3).
NOTE: Due to the adhesive quality of the thermal material located between the fan/heat sink
assembly and system board components, it may be necessary to move the fan/heat sink assembly
from side to side to detach the assembly.
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink assembly
and the system board each time the fan/heat sink assembly is removed. Thermal paste is used on
capacitors and their contacts (1), on the processor and contact (2), and on the Northbridge chip
and contact (3).
Reverse this procedure to install the fan/heat sink assembly.
92 Chapter 4 Removal and replacement procedures
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