HP PAVILION DV7 Disassembly Instructions

EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
N/A
0
Components, parts and materials containing
radioactive substances
N/A
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Philips Screw drivers (For disassembly 1 pc screw on Service door)
1#
2.55~3.00kgf.cm
Description #2 Philips Screw drivers (For disassembly 1 pc screw on ODD drivers)
1#
2.55~3.00kgf.cm
Description #3 Philips Screw drivers (For disassembly 2 pcs screws on 1
st
HDD drivers)
1#
2.55~3.00kgf.cm
Description #4 Philips Screw drivers (For disassembly 2 pcs screws on 2
nd
HDD drivers)
1#
2.55~3.00kgf.cm
Description #5 Philips Screw drivers (For disassembly 20 pcs screws on Low case)
1#
2.55~3.00kgf.cm
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Push Battery Latch and remove Battery module.
2. Remove 1 pc screw on Service door.
3. Remove 1 pc screw on ODD module.
4. Remove 2 pcs screws on 1
st
HDD drivers.
5. Remove 2 pcs screws on 2
nd
HDD drivers.
6. Remove 20 pcs screws on Low case.
7. Remove KB module.
8. Remove 1 pc screw on U case
9. Remove U case.
10. Remove 4 pcs screws on Hinge.
11. Remove 4 pcs screws on MB.
12. Remove 1 pc screw on Card reader Board.
13. Remove 1 pc screw on USB Board.
14. Remove 2 pcs screws on Sub Woofer.
15. Remove 2 pcs screws on ODD connector.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

HP PAVILION DV7 Specifications

General

LED backlight	Yes
Display surface	Gloss
Display diagonal	17.3 \
Display brightness	200 cd/m²
Display resolution	1600 x 900 pixels
Native aspect ratio	16:9
Bus type	DMI
Stepping	L1
Tjunction	105 °C
Processor cache	3 MB
Processor cores	2
Processor model	i5-3210M
System bus rate	5 GT/s
Processor family	Intel® Core™ i5
Processor series	Intel Core i5-3200 Mobile series
Processor socket	BGA 1023
Processor threads	4
Processor codename	Ivy Bridge
Processor frequency	2.5 GHz
Processor cache type	L3
Processor lithography	22 nm
Processor manufacturer	Intel
Processor front side bus	- MHz
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
Processor operating modes	64-bit
PCI Express configurations	1x16, 2x8, 1x8+2x4
Thermal Design Power (TDP)	35 W
CPU multiplier (bus/core ratio)	25
Maximum number of PCI Express lanes	16
Motherboard chipset	Intel HM77 Express
Memory slots	2x SO-DIMM
Internal memory	6 GB
Internal memory type	DDR3-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 2 + 1 x 4 GB
HDD speed	5400 RPM
HDD interface	SATA
Storage media	HDD
Optical drive type	DVD Super Multi DL
Total storage capacity	1000 GB
Compatible memory cards	MMC, SD
Number of HDDs installed	1
Number of SSDs installed	0
On-board graphics card ID	0x166
Discrete graphics card model	NVIDIA® GeForce® GT 630M
On-board graphics card model	Intel® HD Graphics 4000
Discrete graphics memory type	GDDR3
On-board graphics card family	Intel® HD Graphics
On-board graphics card base frequency	650 MHz
On-board graphics card dynamic frequency (max)	1100 MHz
Audio system	Beats Audio
Video capturing speed	30 fps
Front camera resolution	1280 x 720 pixels
Wi-Fi standards	802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	4.0
Cabling technology	10/100/1000Base-T(X)
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
Headphone connectivity	3.5 mm
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	3
Keyboard layout	-
Pointing device	Touchpad
Operating system installed	Windows 7 Home Premium
Form factor	Clamshell
Product type	Laptop
Product color	Black
Country of origin	China
Battery capacity	2800 mAh
Battery life (max)	- h
Number of battery cells	6
AC adapter power	90 W
Operating altitude	-15 - 3048 m
Non-operating altitude	-15 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Processor code	SR0N0
Processor ARK ID	65708
Processor package size	31.0 x 24.0 (BGA1023) mm
Supported instruction sets	AVX
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	274 mm
Width	416 mm
Height	35.2 mm
Weight	3150 g