HP pavilion x360 Product End-Of-Life Disassembly Instructions

EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Notebooks and Tablet PCs
Marketing Name / Model
[List multiple models if applicable.]
HP Pavilion x360 Converitble PC 15
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCB
1
Batteries
All types including standard alkaline and lithium
coin or button style batteries Battery pack
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries N/A
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps LED
1
Cathode Ray Tubes (CRT)
N/A
0
Capacitors / condensers (Containing PCB/PCT)
N/A
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
N/A
0
External electrical cables and cords
N/A
0
Gas Discharge Lamps
N/A
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
N/A
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. N/A
0
Components and waste containing asbestos
N/A
0

HP pavilion x360 Specifications

General

Form factor	Convertible (Folder)
Product type	Hybrid (2-in-1)
Product color	Silver
Country of origin	China
Electronic compass	Yes
Motherboard chipset	Intel SoC
Memory slots	2x SO-DIMM
Internal memory	4 GB
Memory clock speed	1600 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR3L-SDRAM
Maximum internal memory	16 GB
Memory layout (slots x size)	1 x 4 GB
3D	No
HDD size	2.5 \
HDD speed	5400 RPM
HDD interface	SATA III
Storage media	HDD
Total storage capacity	500 GB
Compatible memory cards	SD, SDHC, SDXC
Number of HDDs installed	1
Display diagonal	15.6 \
Touch technology	Multi-touch
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
On-board graphics card ID	0x5916
Discrete graphics card model	Not available
On-board graphics card model	Intel® HD Graphics 620
On-board graphics card family	Intel® HD Graphics
Maximum on-board graphics card memory	32 GB
On-board graphics card OpenGL version	4.4
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Number of built-in speakers	2
Wi-Fi standards	Wi-Fi 5 (802.11ac)
Bluetooth version	4.2
Ethernet LAN data rates	10, 100, 1000 Mbit/s
Charging port type	DC-in jack
USB 2.0 ports quantity	USB 2.0 ports have a data transmission speed of 480 Mbps, and are backwards compatible with USB 1.1 ports. You can connect all kinds of peripheral devices to them.
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	0
Pointing device	Touchpad
Operating system architecture	64-bit
Battery capacity	48 Wh
Number of battery cells	3
AC adapter power	45 W
AC adapter frequency	50 - 60 Hz
AC adapter input voltage	100 - 240 V
Cable lock slot type	Kensington
Password protection type	Power on
Package depth	305 mm
Package width	520 mm
Package height	69 mm
Package weight	2950 g
Operating altitude	-15.2 - 3048 m
Non-operating altitude	-15.2 - 12192 m
Storage temperature (T-T)	-20 - 60 °C
Operating temperature (T-T)	5 - 35 °C
Storage relative humidity (H-H)	5 - 95 %
Operating relative humidity (H-H)	10 - 90 %
Sustainability certificates	EPEAT Silver, ENERGY STAR
Bus type	OPI
Stepping	H0
Tjunction	100 °C
Processor cache	3 MB
Processor model	i5-7200U
System bus rate	4 GT/s
Processor family	Intel® Core™ i5
Processor socket	BGA 1356
Processor threads	4
Processor codename	Kaby Lake
Configurable TDP-up	25 W
Processor frequency	2.5 GHz
Processor cache type	Smart Cache
Configurable TDP-down	7.5 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.1 GHz
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.7 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	12
Processor code	SR2ZU
Processor ARK ID	95443
Processor package size	42 x 24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00
Intel Stable Image Platform Program (SIPP) version	0.00

Weight and Dimensions

Depth	250 mm
Width	382 mm
Height	23.9 mm
Weight	2300 g