HP ProBook 430 G6 User Manual

EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description
Notes
Quantity of
items
included in
product
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screwdriver
#1
Plum Screwdriver
T8
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Relax screw to disassembly Base case
2. Remove screw*2 to disassembly Battery
3. Remove screw*2 and HDD cable to disassembly HDD assy
4. Remove screw*2 to disassembly FAN
5. Remove screw*3 to disassembly Type-C BKT and RJ frame module
6. Removed Daughter board & FFC & FPC on Top-assy：Power, SD, TP module, Finger printer
7. Remove screw*5 & DC/KB/LCD/Antenna cable to disassembly MB
8. Remove screw*4 to disassembly LCD module
9. Disassembly LCD Bezel-assy with LCD Cover-assy
10. Remove adhesive to disassembly Panel
11. Remove screw*6 to disassembly hinge
12. Remove cable: LVDS, Antenna
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).

HP ProBook 430 G6 Specifications

General

Form factor	Clamshell
Product type	Laptop
Product color	Silver
Country of origin	China
Market positioning	Business
Panel type	SVA
LED backlight	Yes
Display diagonal	13.3 \
Display brightness	220 cd/m²
Display resolution	1366 x 768 pixels
Native aspect ratio	16:9
Bus type	OPI
Tjunction	100 °C
Processor cache	4 MB
Processor cores	2
Processor model	i3-8145U
System bus rate	4 GT/s
Processor family	Intel® Core™ i3
Processor socket	BGA 1528
Processor threads	4
Processor codename	Whiskey Lake
Configurable TDP-up	25 W
Processor frequency	2.1 GHz
Processor cache type	Smart Cache
Configurable TDP-down	10 W
Processor lithography	14 nm
Processor manufacturer	Intel
PCI Express slots version	3.0
Processor boost frequency	3.9 GHz
Processor operating modes	64-bit
PCI Express configurations	1x2+2x1, 1x4, 2x2, 4x1
Thermal Design Power (TDP)	15 W
Configurable TDP-up frequency	2.3 GHz
Configurable TDP-down frequency	0.8 GHz
Maximum number of PCI Express lanes	16
Memory slots	2x SO-DIMM
Internal memory	8 GB
Memory clock speed	2400 MHz
Memory form factor	SO-DIMM
Internal memory type	DDR4-SDRAM
Maximum internal memory	32 GB
Memory layout (slots x size)	1 x 8 GB
SSD capacity	The Solid State Drive's storage capacity in Gigabytes.
Storage media	SSD
SSD form factor	M.2
Total storage capacity	128 GB
Compatible memory cards	SD, SDHC, SDXC
Number of SSDs installed	1
On-board graphics card ID	0x3EA0
Discrete graphics card model	Not available
On-board graphics card model	Intel® UHD Graphics
On-board graphics card OpenGL version	4.5
On-board graphics card base frequency	300 MHz
On-board graphics card DirectX version	12.0
On-board graphics card dynamic frequency (max)	1000 MHz
Battery capacity	45 Wh
Number of battery cells	3
AC adapter power	65 W
Password protection type	Power on
Front camera signal format	720p
Antenna type	2x2
Wi-Fi standards	802.11a, Wi-Fi 5 (802.11ac), 802.11b, 802.11g, Wi-Fi 4 (802.11n)
Bluetooth version	5.0
Top Wi-Fi standard	Wi-Fi 5 (802.11ac)
WLAN controller model	Intel Dual Band Wireless-AC 9560
Ethernet LAN data rates	10, 100, 1000 Mbit/s
HDMI version	1.4b
Charging port type	DC-in jack
USB 2.0 ports quantity	0
Pointing device	Clickpad
Processor ARK ID	149090
Intel TSX-NI version	0.00
Processor package size	46x24 mm
Supported instruction sets	AVX 2.0, SSE4.1, SSE4.2
Intel Identity Protection Technology version	1.00

Weight and Dimensions

Depth	231 mm
Width	308.5 mm
Height	18 mm
Weight	1490 g