EL-MF877-00 Page 2
Template Revision C
Last revalidation date 09-May-2018
HPI instructions for this template are available at EL-MF877-01
Item Description Notes
items
included in
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. NA
Components and waste containing asbestos
Components, parts and materials containing refractory
ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:
1. Use screwdriver to release base cover screw 5pcs, and disassemble base cover from hinge side.
2. Use screwdriver to release battery screw 6pcs, and release Battery Cable & Battery.
3. Use screwdriver to release FAN screw 3pcs, and release FAN
4. Use screwdriver to release Type-C BKT screw 3pcs, and release Type-C BKT.
5. Use screwdriver to release main board screw 4pcs
6. Release below cable: DC-IN Cable, Speaker L/R Cable , RTC-Battery Cable , Finger-Printer Cable , NFC Cable TP Cable ,
Backlight Cable , KB Cable , Smart-Card Cable EDP Cable , WLAN antenna Cable.
7. Release Main Board, Release Smart-Card Board.
8. Use screwdriver to release hinge screw and remove hinge up
9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the
product that require selective treatment (with descriptions and arrows identifying locations).
3-21 Use screwdriver to release base cover, and disassemble base cover from hinge side.
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