HP ProDisplay P201 - Page 2

Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw driver of "+" type
Description #2 Hexagonal nut screw driver for DVI and D-SUB connector
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the screws of stand，get down the stand
2. Dismantle the screws of rear cover，
3. Dismantle the rear cover of monitor
4. Tear out all tapes.Remove the screws and disconnect the connectors to separate the MAINFRAME and PANELl
5. Remove the screws and disconnect the connectors.
6. Remove the MAIN BOARD and POWER BOARD
7.
8.
9.
10.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Pls. refer the attached:
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01