EasyManuals Logo

HP ProLiant ML350p G9 User Manual

HP ProLiant ML350p G9
8 pages
To Next Page IconTo Next Page
To Next Page IconTo Next Page
To Previous Page IconTo Previous Page
To Previous Page IconTo Previous Page
Page #2 background imageLoading...
Page #2 background image
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Screw Driver, Philip #2
#2
Description #2 Screw Driver, T15
T15
Description #3 Screw Driver, T10
T10
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. System Board Battery - Locate the battery on the system board. Use a medium flat head screwdriver or fingers to
remove the battery and dispose of properly.
2. Mega-cell - Use a medium flat head screwdriver or fingers to remove the Mega-cell and dispose of properly.
3. Capacitors=>2.5 cm - Remove the PSU from the system. With screw driver, remove the screws securing the top cover,
locate the capacitors and use a medium flat head screwdriver to remove them and dispose of properly.
4.
5.
6.
7.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Attachment 1
.
Attachment 1System Board Battery and Mega-cell Location
Attachment 2-12Capacitors=>2.5 cm location.
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01

Questions and Answers:

Question and Answer IconNeed help?

Do you have a question about the HP ProLiant ML350p G9 and is the answer not in the manual?

HP ProLiant ML350p G9 Specifications

General IconGeneral
Processor Sockets2
Memory Slots24 DIMM slots
Expansion SlotsUp to 9 PCIe 3.0 slots
Form Factor5U Tower
ChipsetIntel C610 series chipset
ProcessorIntel Xeon E5-2600 v3/v4
MemoryUp to 1.5TB DDR4
RAID SupportSmart Array P440ar/2GB FBWC
Network4 x 1GbE embedded ports
Power Supply800W or 1200W (hot-plug, redundant options available)
Operating System SupportMicrosoft Windows Server; Red Hat Enterprise Linux (RHEL); SUSE Linux Enterprise Server (SLES); VMware vSphere

Related product manuals