HP xw8600 Quickspecs

Chlorinated Paraffins
Formaldehyde
Halogenated Diphenyl Methanes
Lead carbonates and sulfates
Lead and Lead compounds
Mercuric Oxide Batteries
Nickel - finishes must not be used on the external surface designed to be frequently handled or
carried by the user.
Ozone Depleting Substances
Polybrominated Biphenyls (PBBs)
Polybrominated Diphenyl Ethers (PBBEs)
Polybrominated Biphenyl Oxides (PBBOs)
Polychlorinated Biphenyl (PCB)
Polychlorinated Terphenyls (PCT)
Polyvinyl Chloride (PVC), except for wires and cables and certain retail packaging, has been
voluntarily removed from most applications.
Radioactive Substances
Tributyl Tinches (TBT), Triphenyl Tinches (TPT), Tributyl Tin Oxide (TBTO)
Packaging
PackagingPackaging
Packaging HP follows these guidelines to decrease the environmental impact of product packaging:
Eliminate the use of heavy metals such as lead, chromium, mercury, and cadmium in packaging
materials.
Eliminate the use of ozone-depleting substances (ODS) in packaging materials.
Design packaging materials for ease of disassembly.
Maximize the use of post-consumer recycled content materials in packaging materials.
Use readily recyclable packaging materials such as paper and corrugated materials.
Reduce size and weight of packages to improve transportation fuel efficiency.
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.
Longevity and Upgrading
Longevity and UpgradingLongevity and Upgrading
Longevity and Upgrading This product is designed to be upgraded, possibly extending its useful life by several years. Spare
parts are available throughout the warranty period and for up to 5 years after the end of
production. Upgradability features contained in the product include:
Intel LGA775 processor sockets
8 USB ports
1 PCI 32-bit/33MHz slot, 1 PCI-X slot and 5 PCI Express slots
8 expansion bays
8 - 16 memory slots, depending on configuration
Packaging Materials
Packaging MaterialsPackaging Materials
Packaging Materials
External
ExternalExternal
External Cardboard carton and insert: 2.70 kg
Internal
InternalInternal
Internal LDPE Foam: 0.35 kg
End-of-Life Management
End-of-Life ManagementEnd-of-Life Management
End-of-Life Management
and Recycling
and Recyclingand Recycling
and Recycling
Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas.
To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales
office. Products returned to HP will be recycled, recovered, or disposed of in a responsible manner.
Hewlett-Packard
Hewlett-PackardHewlett-Packard
Hewlett-Packard
Corporate Environmental
Corporate EnvironmentalCorporate Environmental
Corporate Environmental
Information
InformationInformation
Information
For more information about HP's commitment to the environment:
[link to new HP white paper now in progress]
Global Citizenship Report: http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications:
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
Service, Support and
Service, Support andService, Support and
Service, Support and
Warranty
WarrantyWarranty
Warranty
On-site Warranty and Service (
Note 1
): This three-year, limited warranty and service offering delivers three
years of on-site, next business-day (
Note 2
) service for parts and labor and includes free telephone support
QuickSpecs
HP xw8600 Workstation
HP xw8600 WorkstationHP xw8600 Workstation
HP xw8600 Workstation
System Technical Specifications
DA - 12849 North America — Version 18 — October 1, 2009 Page 22

HP xw8600 Specifications

General

Chipset	Intel 5400
Form Factor	Tower
Processor	Intel Xeon 5400 series
Memory	Up to 32GB DDR2 FB-DIMM
Storage	SATA or SAS hard drives
Graphics	NVIDIA Quadro or ATI FirePro
Operating System	Windows XP, Vista, or Linux
Expansion Slots	PCI, PCI-X, PCIe
Power Supply	800W