MF877-00 Page 1
Template Revision B, 18-Nov-2016
HPE instructions for this template are available at MF877-01
Product End-of-Life Disassembly Instructions
Product Category
Marketing Name / Model
[List multiple models if applicable.]
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
included in
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
All types including standard alkaline and
lithium coin or button style batteries
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches,
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays
with gas discharge lamps
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Plastic topcover and lightpipe contain no
brominated flame retardants.
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Topcover pad printing include ink and
lightpipe contains titanium dioxide