9
Declaration on Hazardous Substances in Electronic
Information Products
○: Indicates that the concentration of the hazardous substance contained in all the homogeneous
materials of this part is below the limit requirement of the SJ/T 11363−2006 standard.
×: Indicates that the concentration of the hazardous substance contained in all the homogeneous
materials of this part is above the limit requirement.
1. Shell and mechanical part: the steel, aluminum or copper lead.
2. Board / circuit module:
PCB pad lead.
Board ceramic / PEG / mica capacitor and inductance lead.
The internal clock oscillator resistor lead.
Lead - optical transceiver module internal optical glass and optical joints.
Lead RF coaxial connector.
With a high temperature solder used to lead content of more than 85% - transformer.
Lead inductance, for optical glass.
High temperature solders welding - use of a transistor chip lead solder.
The use of ceramic resistors, ceramic lead.
The board IC, power supply and other components such as lead pin and solder.
3. Signal lines: one of the steel, aluminum, copper and other alloy materials in lead.
4. Cable connector: most of the connector metal shell, terminal and other lead, lead, etc..
5. Power adapter: internal lead.
6. Supporting equipment in the circuit board lead, with the above first, second.