Intel DH61CR User Manual

Contents
ix
5 Regulatory Compliance and Battery Disposal Information
5.1 Regulatory Compliance ...................................................................... 75
5.1.1 Safety Standards................................................................... 75
5.1.2 European Union Declaration of Conformity Statement ................ 76
5.1.3 Product Ecology Statements ................................................... 77
5.1.4 EMC Regulations ................................................................... 79
5.1.5 ENERGY STAR* 5.0, e-Standby, and ErP Compliance ................. 82
5.1.6 Regulatory Compliance Marks (Board Level) ............................. 83
5.2 Battery Disposal Information .............................................................. 84
Figures
1. Major Board Components .................................................................. 13
2. Block Diagram .................................................................................. 15
3. Memory Channel and DIMM Configuration ............................................ 19
4. Back Panel Audio Connector Options ................................................... 25
5. LAN Connector LED Locations ............................................................. 27
6. Thermal Sensors and Fan Headers ...................................................... 29
7. Location of the Standby Power LED (Green) ......................................... 37
8. Detailed System Memory Address Map ................................................ 40
9. Back Panel Connectors ...................................................................... 42
10. Component-side Connectors and Headers ............................................ 43
11. Connection Diagram for Front Panel Header ......................................... 49
12. Connection Diagram for Front Panel USB Headers ................................. 51
13. Location of the Jumper Block ............................................................. 52
14. Intel MEBX Reset Header ................................................................... 54
15. Board Dimensions ............................................................................. 55
16. Localized High Temperature Zones ..................................................... 59
Tables
1. Feature Summary ............................................................................. 11
2. Components Shown in Figure 1 .......................................................... 14
3. Supported Memory Configurations ...................................................... 18
4. Audio Jack Support ........................................................................... 23
5. LAN Connector LED States ................................................................. 27
6. Effects of Pressing the Power Switch ................................................... 31
7. Power States and Targeted System Power ........................................... 32
8. Wake-up Devices and Events ............................................................. 33
9. System Memory Map ........................................................................ 41
10. Component-side Connectors and Headers Shown in Figure 10 ................ 44
11. TPM Header ..................................................................................... 45
12. Serial Port Header ............................................................................ 45
13. S/PDIF Header ................................................................................. 45
1
4. Internal Mono Speaker Header ........................................................... 45
15. Front Panel Audio Header for Intel HD Audio ........................................ 46

Intel DH61CR Specifications

General

Form Factor	Micro ATX
Chipset	Intel H61
Socket	LGA 1155
Memory Type	DDR3
Memory Slots	2
Max Memory	16 GB
Memory Standard	DDR3 1066/1333
PCIe x16 Slots	1
PCIe x1 Slots	2
PCI Slots	1
RAID Support	No
SATA Ports	4 x SATA 3Gb/s
USB Ports	4 x USB 2.0
VGA	1 x VGA
DVI	Yes