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4.1 Introduction...................................................................................................................................................... 4-1

4.2 Power limits...................................................................................................................................................... 4-1

4.3 Mainframe control of matrix card................................................................................................................. 4-1

4.3.1 Channel assignments .............................................................................................................................. 4-2

4.3.2 Front panel control .................................................................................................................................. 4-4

4.3.3 IEEE-488 bus operation........................................................................................................................... 4-4

4.4 Matrix switching examples ............................................................................................................................ 4-5

4.4.1 Thick film resistor network testing ....................................................................................................... 4-5

4.4.2 Transistor testing ................................................................................................................................... 4-10

4.5 Measurement considerations....................................................................................................................... 4-13

4.5.1 Path isolation.......................................................................................................................................... 4-13

4.5.2 Magnetic fields....................................................................................................................................... 4-14

4.5.3 Radio frequency interference............................................................................................................... 4-14

4.5.4 Ground loops ......................................................................................................................................... 4-14

4.5.5 Keeping connectors clean..................................................................................................................... 4-15

4.5.6 AC frequency response......................................................................................................................... 4-15

5.1 Introduction..................................................................................................................................................... 5-1

5.2 Handling and cleaning precautions.............................................................................................................. 5-1

5.3 Performance verification ................................................................................................................................ 5-2

5.3.1 Environmental conditions...................................................................................................................... 5-2

5.3.2 Recommended equipment ..................................................................................................................... 5-2

5.3.3 Matrix card connections ......................................................................................................................... 5-3

5.3.4 Channel resistance tests.......................................................................................................................... 5-3

5.3.5 Offset current tests................................................................................................................................... 5-4

5.3.6 Contact potential tests............................................................................................................................. 5-6

5.3.7 Path isolation tests................................................................................................................................... 5-7

5.3.8 Differential and common-mode isolation tests................................................................................... 5-9

5.4 Special handling of static-sensitive devices............................................................................................... 5-11

5.5 Principles of operation.................................................................................................................................. 5-12

5.5.1 Block diagram ........................................................................................................................................ 5-12

5.5.2 ID data circuits ....................................................................................................................................... 5-13

5.5.3 Relay control........................................................................................................................................... 5-13

5.5.4 Relay power control .............................................................................................................................. 5-14

5.5.5 Power-on safeguard .............................................................................................................................. 5-14

5.6 Troubleshooting............................................................................................................................................. 5-15

5.6.1 Troubleshooting equipment................................................................................................................. 5-15

5.6.2 Troubleshooting access......................................................................................................................... 5-15

5.6.3 Troubleshooting procedure.................................................................................................................. 5-15

6.1 Introduction...................................................................................................................................................... 6-1

6.2 Parts lists ............................................................................................................................................................6-1

6.3 Ordering information...................................................................................................................................... 6-1

6.4 Factory service.................................................................................................................................................. 6-1

6.5 Component layouts and schematic diagrams ............................................................................................. 6-2

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