B-LINK ELECTRONIC CO., LTD in shenzhen
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7. Typical Solder ReflowProfile
8. Precautions for use
1. Pls handle the module under ESD protection.
2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature
245℃.
3.Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity
< 70% RH, over 96 hours.
Baking condition: 125 degree C, 12 hours
Baking times: 1 time
4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The
calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity
indicator cards must be blue, <30%.
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