Table26.Removalstepsoftopshieldingassembly(continued)
1
M2×2mm,wafer-head,nylon-coated(1)Silver
0.181Nm
(1.85kgfcm)
2
M2×3mm,wafer-head,nylon-coated(2)
Black0.181Nm
(1.85kgfcm)
3
M2×5mm,wafer-head,nylon-coated(4)
Black0.181Nm
(1.85kgfcm)
1170Systemboardassembly
Importantnoticesforhandlingthesystemboard:
Whenhandlingthesystemboard,bearthefollowinginmind.
•Thesystemboardhasanaccelerometer,whichcanbebrokenbyapplyingseveralthousandsofG-forces.
Note:Droppingasystemboardfromaheightofaslittleas6inchessothatitfallsatonahardbench
cansubjecttheaccelerometertoasmuchas6,000G'sofshock.
•Becarefulnottodropthesystemboardonabenchtopthathasahardsurface,suchasmetal,wood,or
composite.
•Ifasystemboardisdropped,youmusttestit,usingPC-DoctorforDOS,tomakesurethattheHDD
ActiveProtectionSystem
TM
stillfunctions(seebelow).
Note:IfthetestshowsthatHDDActiveProtectionSystemisnotfunctioning,besuretodocumentthe
dropinanyrejectreport,andreplacethesystemboard.
•Avoidroughhandlingofanykind.
•Ateverypointintheprocess,besurenottodroporstackthesystemboard.
•Ifyouputasystemboarddown,besuretoputitonlyonapaddedsurfacesuchasanESDmator
conductivecorrugatedmaterial.
Afterreplacingthesystemboard,runPC-DoctorforDOStomakesurethatHDDActiveProtectionSystem
stillfunctions.Theprocedureisasfollows:
1.Placethecomputeronahorizontalsurface.
2.RunDiagnostics➙ThinkPadDevices➙HDDActiveProtectionTest.
Attention:Donotapplyphysicalshocktothecomputerwhilethetestisrunning.
Foraccess,removetheseFRUs,inorder:
•“1010Batterypack”onpage58
•“1020Opticaldriveortravelcover”onpage58
•“1030Thermalcover”onpage59
•“1040Harddiskdrive(HDD)assembly”onpage60
•“1050DIMM”onpage61
•“1060Fanassembly”onpage63
•“1070CPU”onpage66
•“1080WirelessWANslotcoverandPCIExpressMiniCardforwirelessWAN”onpage67
•“1090Palmrestassemblywithcables”onpage69
•“1100PCIExpressMiniCardforwirelessLAN”onpage72
•“1110Backupbattery”onpage74
•“1120Bluetoothdaughtercard(BDC-2)”onpage75
•“1130Keyboard”onpage75
•“1140Keyboardbezel”onpage78
Chapter8.RemovingorreplacingaFRU85