LG 32LF20FR - Page 20

+1.8V_DDR
DDR2_A[0-12]
DDR2_BA0 DDR2_BA1 DDR2_MCLK DDR2_MCLKZ DDR2_CKE DDR2_ODT DDR2_RASZ DDR2_CASZ DDR2_WEZ DDR2_DQS0P DDR2_DQS1P DDR2_DQM0 DDR2_DQM1 DDR2_DQS0M DDR2_DQS1M
+1.8V_DDR
+1.8V_DDR
DDR2_D[0-15]
1000pF C905
V_REF
56 R900
56
R901
56 R902
56 R903
56
R904
56 R905
0.01uF C904
0.01uF 50V C900
0.01uF C901
0.01uF C902
0.01uF C903
0.01uF C906
0.01uF C907
0.01uF C908
0.01uF C909
0.01uF C910
0.01uF C911
0.01uF C912
0.01uF C913
0.01uF C914
0.01uF C915
0.01uF C916
0.01uF C917
+1.8V_DDR
150
R906
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
V_REF
0.1uF 50V C918
HYB18TC512160B2F-2.5
IC900
J2
VREF
J8
CK
H2
VSSQ2
B7
UDQS
N8
A4
P8
A8
L1
NC4
L2
BA0
R8
NC3
K7
RAS
F8
VSSQ3
F3
LDM
P3
A9
M3
A1
N3
A5
K8
CK
R3
NC5
L3
BA1
J7
VSSDL
L7
CAS
F2
VSSQ4
B3
UDM
M2
A10/AP
K2
CKE
R7
NC6
M7
A2
N7
A6
M8
A0
J1
VDDL
K3
WE
E8
LDQS
P7
A11
K9
ODT
A2
NC1
N2
A3
P2
A7
H8
VSSQ1
F7
LDQS
A8
UDQS
R2
A12
L8
CS
E2
NC2
E7
VSSQ5
D8
VSSQ6
D2
VSSQ7
A7
VSSQ8
B8
VSSQ9
B2
VSSQ10
P9
VSS1
N1
VSS2
J3
VSS3
E3
VSS4
A3
VSS5
G9
VDDQ1
G7
VDDQ2
G3
VDDQ3
G1
VDDQ4
E9
VDDQ5
C9
VDDQ6
C7
VDDQ7
C3
VDDQ8
C1
VDDQ9
A9
VDDQ10
R1
VDD1
M9
VDD2
J9
VDD3
E1
VDD4
A1
VDD5
B9
DQ15
B1
DQ14
D9
DQ13
D1
DQ12
D3
DQ11
D7
DQ10
C2
DQ9
C8
DQ8
F9
DQ7
F1
DQ6
H9
DQ5
H1
DQ4
H3
DQ3
H7
DQ2
G2
DQ1
G8
DQ0
10uF 10V C919
1K
R907
1K
R908
DDR2_A[0] DDR2_A[12] DDR2_A[11] DDR2_A[1] DDR2_A[2] DDR2_A[3] DDR2_A[4] DDR2_A[5] DDR2_A[6] DDR2_A[7] DDR2_A[8] DDR2_A[9] DDR2_A[10]
DDR2_D[0-15]
DDR2_D[0] DDR2_D[1] DDR2_D[2] DDR2_D[3] DDR2_D[4] DDR2_D[5] DDR2_D[6] DDR2_D[7] DDR2_D[8] DDR2_D[9]
DDR2_D[10] DDR2_D[11] DDR2_D[12] DDR2_D[13] DDR2_D[14] DDR2_D[15]
DDR2 MEMORY
Close to DDR2 IC
Close to DDR2 IC
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
DDR2