LG LG-D855 - Page 352

12. EXPLODED VIEW & REPLACEMENT PART LIST
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Copyright © 2014 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Level Location no Description P/N Specification Remark
4 EBR071500
PCB Assembly
Main,Insert
EBR79601101 LGD855.A6D2TN 1.1 Main
5 EBR071600
PCB Assembly
Main,SMT Bottom
EBR78903709 LGD855.A6D2TN 1.5 Main
5 EBR071700
PCB Assembly
Main,SMT Top
EBR78882409 LGD855.A6D2TN 1.5 Main
4 EBR071800
PCB Assembly
Main,SMT
EBR78903616 LGD855.A6D2TN 1.2 Main
6 EBR072600
PCB Assembly
Sub,SMT Bottom
EBR78759605 LGD855.ADEUWH 1.0 Sub
6 EBR072700
PCB Assembly
Sub,SMT Top
EBR78784105 LGD855.ADEUWH 1.0 Sub
5 EBR072800
PCB Assembly
Sub,SMT
EBR78759505 LGD855.ADEUWH 1.0 Sub
6
L1100
L1104
L1115
L1137
Inductor
Multilayer
Chip
EAP61866701
LG HK0603 82NJ-T 82NH 5% - 70mA - - 3.37OHM
1GHZ 4 SHIELD 0 0.6X0.3X0.3MM R/TP TAIYO
YUDEN CO.,LTD
6 L1106
Inductor
Multilayer
Chip
EAP62227301
LG HK 0603 2N2S-T 2.2NH 0.3NH - 360mA - -
0.19OHM 8.8GHZ 4 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6 L1106
Inductor
Multilayer
Chip
EAP62227301
LG HK 0603 2N2S-T 2.2NH 0.3NH - 360mA - -
0.19OHM 8.8GHZ 4 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6
L1119
L1168
L1309
L1323
Inductor
Multilayer
Chip
EAP62227901
LG HK 0603 18NJ-T 18NH 5% - 180mA - -
0.71OHM 2.3GHZ 5 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6
L1122
L1211
L1214
Inductor
Multilayer
Chip
EAP62246301
LG HK 0603 15NJ-T 15NH 5% - 180mA - -
0.71OHM 5HZ 2.3G SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6 L1123
Capacitor
Ceramic
Chip
ECCH0009211
GRM0335C1E3R3C 3.3pF 0.25PF 25V X7R -
55TO+125C 0603 R/TP - MURATA
MANUFACTURING CO.,LTD.
6 L1124
Inductor
Multilayer
Chip
EAP62246201
LG HK 0603 10NJ-T 10NH 5% - 220mA - -
0.51OHM 2.9GHZ 5 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD
6
L1133
L1322
Inductor
Multilayer
Chip
EAP62227701
LG HK 0603 8N2J-T 8.2NH 5% - 230mA - -
0.45OHM 3.4GHZ 5 SHIELD - 0.6X0.3X0.3MM
R/TP TAIYO YUDEN CO.,LTD