12. EXPLODED VIEW & REPLACEMENT PART LIST
Level Location No. Description PartNumber Spec Remark
5 ABM01
Can Assembly,
Shield
ABM73616201 LGE730.AORUTN ZZ:Without Color SUS 0.15T
6 R235 Resistor, Chip ERHY0000193
RC1005F270CS 27OHM 1% 1/16W 1005 R/TP -
SAMSUNG ELECTRO-MECHANICS CO., LTD.
6 FB902
Inductor, Multilayer,
Chip
ELCH0004720
1005GC2T1N2SLF 1.2NH 0.3NH - 300mA 0.12OHM
9GHZ 8 SHIELD NONE 1.0X0.5X0.5MM R/TP
PILKOR ELECTRONICS LTD.
6
C907,
C908
Capacitor, Ceramic,
Chip
ECZH0001122
C1005X7R1H681KT000F 680pF 10% 50V X7R -
55TO+125C 1005 R/TP - TDK KOREA
COOPERATION
6 U200 IC, MCP, eMMC EAN62131501
H26M21001ECR 2GBYTE 2.7VTO3.6V,
1.7VTO1.95V 11.5x13.0x1.2 TR 153P MLC NAND
FBGA 2GB eMMC v4.41 (32nm 16Gb MLC NAND)
HYNIX SEMICONDOCTOR
6
R200,
R201,
R202,
R203,
R204,
R205,
R206,
R207,
R208,
R216,
R221,
R426,
R808
Resistor, Chip ERHY0009505
MCR006YZPJ103 10KOHM 5% 1/20W 0603 R/TP -
ROHM.
6
C410,
C700,
C712
Capacitor, Ceramic,
Chip
ECCH0009106
C0603X7R1C103KT 10nF 10% 10V X7R -
55TO+125C 0603 R/TP - TDK CORPORATION
6 Q700 TR, Bipolar EQBN0012401
KRC402E NPN 30V 0V 50V 100mA 500mA 50
100mW ESM R/TP 3P KEC CORPORAITION