Loctite 3609 User Manual

Technical Data Sheet
3609™
March-2009
PRODUCT DESCRIPTION
3609™ provides the following product characteristics:
Technology Epoxy
Chemical Type Epoxy
Appearance (uncured) Dark, red viscous gel
LMS
Components One component - requires no mixing
Cure Heat cure
Application Surface mount adhesive
Key Substrates SMD components to PCB
Other Application Areas Small parts bonding
Dispense Method Syringe
Dispense Speed Medium 15,000 -25,000 dots/h
Wet Strength High
3609™ is designed for the bonding of surface mounted devices
to printed circuit boards prior to wave soldering. Particularly
suited for applications where medium to high dispense speeds,
high dot profile, high wet strength and good electrical
characteristics are required. 3609™ has been used
successfully in lead free processes with water and alcohol
based fluxes under conditions outlined in the Environmental
Resistance section.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.2
Particle Size, µm <150
Flash Point - See MSDS
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 700
LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
0.16 to 2.0
VISCOSITY VS. TEMPERATURE
The following graph shows a typical temperature-viscosity
curve as measured using a Haake rotoviscometer PK100,
M10/PK1 2° Cone system at a shear rate of 2 s
-1
which is
representative of the shear rate in the dispense nozzle.
Increased cabin or nozzle temperature in the 30°C to 35°C
range may aid dispense performance at higher dispense
speeds.
Viscosity, Pa∙s
Temperature, °C
400
300
200
100
0
20 25 30 35
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature.
Cure Speed vs. Time, Temperature
The following graph shows the rate of torque strength
developed with time at different temperatures. These times are
defined from the moment the adhesive reaches cure
temperature. In practice, total oven time may be longer to allow
for heat up period. Strength is measured on 1206 capacitors @
22 °C, tested according to IPC SM817, TM-650 Method 2.4.42.
% of Full Strength
Time at Temperature, minutes
100
75
50
25
0
0 1 2 3 4 5 6 7 8 9 10
150°C
125°C
100°C
TYPICAL PROPERTIES OF CURED MATERIAL
Cured for 30 minutes @ 150 °C
Physical Properties:
Coefficient of Thermal Expansion,
ISO 11359-2, K
-1
145×10
-6
Coefficient of Thermal Conductivity, ISO 8302,
W/(m·K)
0.4
Glass Transition Temperature, ASTM D 4065, °C 73
Specific Heat, kJ/(kg·K) 0.3
Density, BS 5350-B1 @ 25 °C, g/cm³ 1.4
Electrical Properties:
Surface Resistivity, IEC 60093, Ω 2×10
15
Volume Resistivity, IEC 60093, Ω·cm 2×10
15
Surface Insulation Resistance, Ω:
SN 59651:
Initial 0.1×10
9
Aged for 4 days @ 40 °C, 93 % RH 10×10
9
Aged for 21 days @ 40 °C, 93 % RH 1×10
9
Electrolytic Corrosion, DIN 53489 AN-1.2
Dielectric Constant / Dissipation Factor, IEC 60250:
1-kHz 3.7 / 0.009
10-kHz 3.3 / 0.03
1,000-kHz 3.2 / 0.03
10,000-kHz 3.1 / 0.03

Loctite 3609 Specifications

General

Brand	Loctite
Model	3609
Category	Paint Sprayer
Language	English

Summary

Product Overview

Product Characteristics

Lists key product features including technology, chemical type, appearance, components, and cure.

Application Focus

Details 3609™'s design for bonding surface mounted devices to PCBs prior to wave soldering.

Material Properties and Performance

Uncured Material Properties

Details physical and rheological properties of the uncured adhesive, including specific gravity and viscosity.

Viscosity vs. Temperature

Presents a graphical analysis of how viscosity changes with temperature.

Curing Performance

Describes recommended curing conditions and shows cure speed relative to time and temperature.

Cured Material Properties

Outlines physical, thermal, and electrical characteristics after curing.

Adhesive Properties

Details adhesive performance metrics like push-off, pull-off, and torque strength after curing.

Resistance to Process Conditions

Evaluates how the adhesive retains strength after exposure to process conditions like heat and wave soldering.

Resistance to Lead Free Solder

Confirms product suitability and performance in lead-free wave soldering processes.

Environmental Resistance

Assesses material performance under various environmental conditions like heat, humidity, and solvent exposure.

Hot Strength

Shows the retention of adhesive strength at elevated temperatures.

Resistance to Hot Solder Dip

Details the product's performance when subjected to a hot solder dip process.

General Information and Usage

General Information

Provides guidance on handling, safety, and general product information.

Directions for Use

Step-by-step instructions for dispensing, storage, and cleaning the adhesive.

Loctite Material Specification

References material specifications and availability of batch test reports.

Storage, Notes, and Trademarks

Storage Instructions

Specifies optimal storage conditions to maintain product properties and shelf life.

Conversions

Provides common unit conversions for technical specifications.

Important Notes and Disclaimers

Contains disclaimers regarding data reliability, usage responsibility, and warranty.

Trademark Usage

Outlines the usage guidelines for Henkel Corporation's trademarks.