MP150 – OFFLINE PRIMARY-SIDE REGULATOR
MP150 Rev. 1.15 www.MonolithicPower.com 2
9/25/2018 MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2018 MPS. All Rights Reserved.
ORDERING INFORMATION
Part Number* Package Top Marking
MP150GJ
TSOT23-5 ADG
MP150GS
SOIC8 MP150
* For Tape & Reel, add suffix –Z (e.g. MP150GJ–Z);
* For Tape & Reel, add suffix –Z (e.g. MP150GS–Z);
PACKAGE REFERENCE
TOP VIEW TOP VIEW
1
2
3
5
4
SOURCE
SOURCE
VCC
FB
DRAIN
VCC
FB
SOURCE
SOURCE
N/C
DRAIN
N/C
N/C
1
2
3
4
8
7
6
5
TSOT23-5 SOIC8
ABSOLUTE MAXIMUM RATINGS
(1)
Drain to SOURCE ......................... -0.7V to 500V
All Other Pins ................................. -0.7V to 6.5V
Continuous Power Dissipation (T
A
= +25°C)
(2)
TSOT23-5 ...................................................... 1W
SOIC8............................................................. 1W
Junction Temperature ............................... 150°C
Lead Temperature .................................... 260°C
Storage Temperature ................ -60°C to +150°C
ESD Capability Human Body Mode .......... 4.0kV
ESD Capability Machine Mode ................... 200V
Recommended Operating Conditions
(3)
Operating Junction Temp. (T
J
) . -40°C to +125°C
Operating VCC range ..................... 5.3V to 5.6V
Thermal Resistance
(4)
θ
JA
θ
JC
TSOT23-5 .............................. 100 ...... 55 ... °C/W
SOIC8...................................... 96 ....... 45 ... °C/W
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature T
J
(MAX), the junction-to-
ambient thermal resistance
JA
, and the ambient temperature
TA. The maximum allowance continuous power dissipation at
any ambient temperature is calculated by
PD(MAX)=(TJ(MAX)-TA)/
JA
. Exceeding the maximum
allowance power dissipation will cause excessive die
temperature, and the regulator will go into thermal shutdown.
Internal thermal shutdown circuit protects the device from
permanent damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.