CONFIDENTIAL
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Customer Care Europe, Middle East & Africa NHL-4u/NHL4/NHL-4j Repairhints
SCCE Training Group 6610/7210/7250 Version 3.0
2003 Nokia Mobile Phones
Date 21/05/2003
© NMP 2003
Checked by:
SCCE Training Group
Approved by:
CC Europe, Middle East & Africa
GENERAL
-How to use this document
Put the colored schematics behind this manual.
Now you are able to follow these specifications with graphical layouts and it is easier for you to find the components
and measuring points.
-Component characteristics
Some components contain important data as tuning values or security data, therefore several steps described are only
feasible if you are able to reflash/ realign the phone and/or rewrite IMEI/SIMlock in certain cases. Please pay attention
to separate notes.
-Broken balls / underfill, µBGAs
All replaceable (not underfilled) µBGA components must be renewed after removing. Reflow with uncontrolled hot air
fan is strictly forbidden! µBGA must only be soldered with NMP approved µBGA rework machines (e.g. Zevac/ OK-Metcal/
Martin) to get durable solder joints.
After removing a µBGA check soldering points, if necessary rework oxidated solderings (broken balls) carefully by
tinplating these areas with few flux and a hot soldering iron. Before placing a new component remove the tin and
clean the PCB, e.g. with help of solder wick and flux cleaner such as “Kontakt LR”.
Use only recommended fluxtype and an appropriate amount of it – avoid drowning the PCB in flux as this will result in
additional faults!
Also check underfilled parts for broken underfill material below. In this case carefully evaluate possible repair actions as
the phone probably was exposed to strong mechanical stress.
“rework” done with uncontrolled hot air PCB drowned in flux oxidated solderings
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