NXP Semiconductors TDA9351 SERIES - Page 29

NO. PART NO. NAME SPECIFICATION
UNIT
QT
Y
BOARD
PLACE
173 JUMPER 2.5mm
PCS
3 MAIN
174 JUMPER 5mm
PCS
3 MAIN
175 JUMPER 7.5mm
PCS
30 MAIN
MAIN
MAIN
MAIN
MAIN
CRT
176 JUMPER 10mm
PCS
17 MAIN
MAIN
MAIN
177 JUMPER 12.5mm
PCS
9 MAIN
MAIN
178 JUMPER 15mm
PCS
3 MAIN
179 JUMPER 20mm
PCS
2 MAIN
1 32-0021MF3-000 HEAT SINK(POWER) 21MF3(1.35mm)
PCS
1 MAIN
2 32-0021HV3-000 HEAT SINK(IC.VERTICAL) 21HV3(1.5mm)
PCS
1 MAIN
3 32-21MMB1-100
HEAT SINK（17823）
21MMB1-1
PCS
1 MAIN
4 32-0007210-000
HEAT SINK（2012）
H=30mm
PCS
1 MAIN
1 43-1103060-000 SCREW(POINTED)
TR 3×6 (acutilingual）
PCS
1 MAIN
2 43-1103080-000 SCREW(POINTED)
TR 3×8 (acutilingual）
PCS
1 MAIN
3 43-1103080-TAP TAPPING SCREW
ST3×8
PCS
1
4 43-1103102-000 SCREW FOR HEAT SINK
M3×10
PCS
2 MAIN
5 43-7130000-000 NUT FOR HEAT SINK M3
PCS
4 MAIN
1 77-00FL001-000 HEAT CONDUCTION SILICON GREASE
PCS
5 MAIN
2 77-00FL002-000 RED GLUE
PCS
6 MAIN
3 77-00FL003-000 ANODE SILICON GREASE
PCS
1 MAIN
PART PLACE
CRT
V432.N451.V513.N601.
Ⅳ、Assistant material
V432.N451.V513.N601.V563.
V432.N451.V513.N601.V563. RP551.
N601.
N451.
V563.
V432.V513.
V451+N451
N601.
V563.
Ⅲ、SCREW
W602.D452.L403.
W207
Ⅱ、Frame
V513.
W707.W807.W809.W810.W812.W904.R826
R511A.W513.W709
W201.L301.W303.L505.W551.W702.W703.
W705.W706
R723. W813.W814.W815.R914.R924. R934.
N801(3-15)
W902.
W206.W504.W505.W509.W510.W553.W556.
W501.W811.C803
W101.W102.W103.W202.W203.W204.W209
W301.W302.W503A.W508.W555.W601.W604.
W608.W701.W706.W708.W712.W713.W714.
N801（12-13).N802（2-3).XS403