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Open-programmable DSP-based hybrid for high-performance wireless hearing aids.
Quad-core architecture, DSP, HEAR accelerator, Cortex-M3, filter engine.
Low-power Bluetooth 5 radio SoC for wearable/medical applications.
Framework for developing Ezairo-based hearing aids and fitting software.
Eclipse-based SDK for RSL10 and EDK for firmware development.
Customizable DSP-based system for specific signal processing needs.
Combines Ezairo 7100 SoC, RSL10 radio, EEPROM, and passive components.
Details on Quad-core, CFX DSP, HEAR accelerator, Cortex-M3, and Filter Engine.
Details on Cortex-M3, LPDSP32, RF Front-End, and Baseband Hardware.
Electrical parameters defining safe operating limits for the device.
Specifies VBAT, VDDO2 supply voltages and current consumption.
Defines current consumption in different modes including standby.
Details specifications for VREG, VDDA, VDBL, VDDC, VDDM voltage regulators.
Specs for Power-On Reset voltage and analog input stage parameters.
Details input impedance, noise, dynamic range, and output driver specs.
Specs for the 10-bit low-speed Analog-to-Digital Converter.
Specs for signal detection unit, ADC resolution, and digital I/O levels.
Specs for PLL lock time, tracking, and group delay.
Table showing VDDC levels based on operating frequency.
Specifications for EA2M EEPROM and RSL10 electrical parameters.
Describes the device's small size and suitability for reflow soldering.
States compliance with RoHS directive and provides solder information.
A simplified block diagram illustrating the hybrid system architecture.
Lists the 57 pads and their internal connections on the hybrid.
Continues listing pad names, ball numbers, and descriptions for the interface.
Circuit schematics illustrating component connections and power distribution.
Continuation of circuit schematics and top-layer keep-out area diagram.
Illustrates how the Ezairo 7160 SL connects in a typical hearing aid application.
Details the 24-bit fixed-point, dual-MAC DSP core and its features.
Describes the optimized engine for common audio processing and filterbanks.
Covers support for data transfer, CODECS, and interfaces for the Cortex-M3.
Explains the low-delay path filter core with up to 160 coefficients.
Lists available DIO pads and their configurable modes and interfaces.
Details the hardware debugger for the CFX DSP via I2C.
Describes the debugger for the Cortex-M3 processor via I2C.
Visual representation of the device's frequency response characteristics.
Details how to retrieve system component identification for Ezairo 7100 and RSL10.
Information on construction materials, moisture sensitivity, and soldering profiles.
Diagram illustrating the recommended re-flow soldering temperature profile.
Warnings and recommendations for handling ESD sensitive devices.
Information on development tools, communication libraries, and contact info.
Specifies the physical dimensions and tolerances of the SIP57 package.
Provides a guide for the recommended PCB footprint for the device.
| Category | Control Unit |
|---|---|
| Manufacturer | ON Semiconductor |
| Model | EZAIRO 7160 SL |
| Interface | I2C, SPI |
| Operating Temperature | -40°C to +85°C |
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