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3601 E. 34th St. Tucson, AZ 85713 USA Tel. +1 520-882-6598 Fax +1 520-882-6599 email: pace@metallographic.com Web: http://www.metallographic.com
Please read this instruction manual carefully and follow all installation, operating and safety guidelines.
NANO 2000T Polisher
Final polishing abrasives include fine diamond, alumina and colloidal silica. For successful
microstructural preparation, the polishing abrasive / cloth combination must be appropriately matched
to the specimen hardness, fracture toughness and corrosion properties of the specimen.
Colloidal Silica
Colloidal silica is a relatively soft abrasive with high chemical activity. It is an ideal chemical
mechanical polishing (CMP) abrasive. The chemical activity of colloidal silica results from the
electrochemical balance (zeta potential) required to keep very fine particles from aggregating. This
chemical balance also produces a surface phenomenon which makes the specimen surface more
chemically active. This produces a surface layer which can be mechanically removed by the colloidal
silica particles themselves, or by the mechanical scrubbing of the surface with the polishing pad.
For ceramics, the combination of fine polycrystalline diamond and colloidal silica improves surface
finishes and increases polishing rates.
Nanometer Alumina
Nanometer alumina is a polycrystalline colloidal alumina processed by a proprietary seeded gell
process. Polycrystalline alumina offers two significant improvements over conventional alumina
calcining processes:
1. Tighter, more controlled particle size distributions
2. Harder alpha alumina particles
The tighter, more controlled particle size distribution is a result of less particle aggregation which
produces significantly less scratching in soft metals, such as aluminum, tin, lead, copper and soft
steels.
Nanometer alumina is available in an acidic (pH 4) or basic (pH 10) range.
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7.5 Final Polishing Abrasives
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