Lead-Free require m e n t for service
INDENTIFICATION:
R egardless of special logo (not always indicated)
O ne m ust treat all sets from 1.1.2005 onw ards, according next
rules.
Im portant note: In fact also products a little older can
also be treated in this way as long as you avoid mixing
solder-alloys (leaded/ lead-free). S o best to alw ays
use SAC 305 and the higher tem peratures belong to
this.
D ue to lead-free technology som e rules have to be respected by the
workshop during a repair:
x Use only lead-free solder alloy Philips S A C 305 with
order code 0622 149 00106. If lead-free
solder-paste is required, please contact the
m anufacturer of your solder-equipm ent. In general
use of solder-paste w ithin w orkshops should be
avoided because paste is not easy to store and to
handle.
x U se only adequate solder tools applicable for
lead-free solder alloy. The solder tool must be able
o To reach at least a solder-tem perature of
400°C ,
o To stabilize the adjusted tem perature at the
solder-tip
o To exchange solder-tips for different
applications.
x Adjust your solder tool so that a tem perature around
360°C
– 380°C is reached and stabilized at the
solder joint. H eating-time of the solder-joint should
not exceed ~ 4 sec. Avoid tem peratures above
400°C otherwise w ear-out of tips will rise drastically
and flux-fluid will be destroyed. To avoid w ear-out of
tips sw itch off un-used equipm ent, or reduce heat.
x Mix of lead-free solder alloy / parts w ith leaded
solder alloy / parts is possible but PHILIPS
recom m ends strongly to avoid mixed
solder alloy types (leaded and lead-free). If one
cannot avoid, clean carefully the
solder-joint from old solder alloy and re-solder with
new solder alloy (SA C 305).
x U se only original spare-parts listed in the
Service-M anuals. Not listed standard-material
(com m odities) has to be purchased at
external com panies.
x Special information for BGA-ICs:
- alw ays use the 12nc-recognizable soldering
tem perature profile of the specific B G A (for
de-soldering alw ays use highest lead-free
tem perature profile, in case of doubt)
- lead free BG A-ICs will be delivered in
so-called ‘dry-packaging’ (sealed pack
including a silica gel pack) to protect the IC
against moisture. After opening, dependent of
MSL-level seen on indicator-label in the bag,
the BG A-IC possibly still has to be baked dry.
This will be com m unicated via AYS-w ebsite.
Do not re-use BG As at all.
x For sets produced before 1.1.2005, containing
leaded soldering-tin and com ponents, all
needed spare-parts w ill be available till the
end of the service-period. For repair of such
sets nothing changes.
x On our w ebsite:
www.atyourservice.ce.Philips.com
You find more information to:
BGA-de-/soldering (+ baking instructions)
H eating-profiles of BG As and other ICs used
in Philips-sets
You w ill find this and m ore technical
information w ithin the “m agazine”, chapter
“workshop new s”.
For additional questions please contact your local
repair-helpdesk.
Warnings,N otes
1-5
www.freeservicemanuals.info
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