USER MANUAL
2.3. Specification
2.4. Applicable scene
1. It is suitable to the de-soldering of the SMD components, such
as SOIC, CHIP, QFP, PLCC, BGA and so on.
2. It is suitable to hot shrink, drying, remove lacquer and
mucosity, thaw, preheating, disinfect and so on.
3. It is suitable for the situation needing different range airflow,
softer or heavier.
4. It is suitable for the hot air lead free de-soldering.
2.5. Setting of the temperature and
air flow
Firstly, place the SMD rework system on the workbench. And then connect well
the power cord and other connection lines. Place the handle on the handle holder
before switching on the power supply.
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